Intel Betting The Farm – Shrinking Business, Margins Down For Few Years, But Aggressively Investing $40B-$43B A Year And More With Subsidies

Intel could follow the path of many other American goliaths such as IBM and General Electric. A slow slide to irrelevancy, spinning off business, and bringing shame to what was once pride for American ingenuity. Instead of that conservative route, they are going to put the metal to the floor, spend every dime Intel makes on investing in more manufacturing, design, and in general catching up in technology.

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Qualcomm RFFE Business Continues Relentless Pace With ultraBAW Filters | $8B Segment By 2025

Qualcomm continues to accelerate their RFFE business by filling more gaps in their product line and building out more capabilities for 5G. With ultraSAW, ultraBAW, and other innovations in filters, modules, envelope trackers, and switches, Qualcomm will likely grow RFFE to $8B in 2025.

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TSMC 3nm Wafer Shipments Pushed Into Q1 2023, 2.5 Years After N5 | TSMC 2nm, Samsung 2nm, And Intel 20A Battle It Out In 2025

SemiAnalysis has been hearing murmurings about TSMC’s N3 having poor yields, poor metal stack performance, being very expensive, and being too late for Apple’s 2022 iPhone. These can’t be confirmed, but we can confirm that TSMC N3 is now shipping in Q1 2023.
The hiccup on N3 brings many questions about TSMC’s competitive positioning versus Intel 20A and Samsung 2nm. Both these nodes are very aggressive and aimed at getting back into a competitive position against TSMC. Intel and Samsung even claim the nodes will bring leadership.

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China Has Built The World’s Most Expensive Silicon Carbide Fab, But Numbers Don’t Add Up

China has built a $2.5B fab that costs more than Cree Wolfspeed’s fab, but it has a fraction the output. The tool chain and process is very custom in silicon carbide and western companies have issues even perfecting one let alone all of them at once. Is this another case where government initiatives, subsidies, and unrealistic targets end up in lighting money on fire?

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Aehr Multi-Wafer Level Burn-in Test for Silicon Carbide and Silicon Photonics Applications

Test intensity for silicon carbide and photonics is very high due to extreme operating ranges. Wafer level burn in could transform the test life cycle for semiconductors. Major wins such as On Semiconductor and Intel validate this.

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The Impending Chinese NAND Apocalypse – YMTC 128 Layer NAND Is The First Semiconductor Where China Is Technologically Competitive

YMTC 128 Layer NAND is the first semiconductor where China is technologically competitive with the leading edge firms from the Western sphere of influence.
Yields are improving and the 2nd fab is being filled with equipment. Once that milestone is reached, the 3rd and 4th fab will be built simultaneously.

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