$8B By 2025, 2023 iPhone Modem, WiFi 7 and Filter Socket Competition With Broadcom, $3B Automotive RF TAMRead more
Apple announced their new 20 billion transistor M2 SoC at WWDC. Unfortunately, it’s quite a minor uplift in performance inRead more
The economic benefit of shrinking semiconductors has ground to a halt and Apple is going to use the same process node for the 3rd year in a row. This unprecedented slowdown in scaling has terrifying implications for the semiconductor industry.Read more
STMicroelectronics, KLA, MKS Instruments, Ampere Computing, Apple, Tesla, Silicon Motion Technology, MACOM TechnologyRead more
Advanced packaging exists on a continuum of cost and throughput vs performance and density. Even though the demand for advanced packaging is obvious, there is an incredible number of advanced packaging types and brand names from Intel (EMIB, Foveros, Foveros Omni, Foveros Direct), TSMC (InFO-OS, InFO-LSI, InFO-SOW, InFO-SoIS, CoWoS-S, CoWoS-R, CoWoS-L, SoIC), Samsung (FOSiP, X-Cube, I-Cube, HBM, DDR/LPDDR DRAM, CIS), ASE (FoCoS, FOEB), Sony (CIS), Micron (HBM), SKHynix (HBM), and YMTC (XStacking). These packaging types are used by all of our favorite companies from AMD, Nvidia, and many more. In Part 2, we will explain all these types of packaging and their uses.Read more
People all over semiconductor world have been speculating about the TSMC and Intel deal. SemiAnalysis wants to set the record straight on these. We are going to dive into the details for wafer supply agreements including prepayment terms and capacity agreements for AMD, Apple, Broadcom, Intel, MediaTek, Nvidia, and Qualcomm.Read more
In this multi-part series we will do a deep dive into the advanced packaging mega-trend. This will include a breakdown of the various types of advanced packaging, flows, tool types, and vendors. In part 1 we dive into what pad limited designs are, the slowdown of Moore’s Law and end of economic shrinks, heterogeneous compute, and the economic and design implications of chiplets.Read more
SemiAnalysis has been hearing murmurings about TSMC’s N3 having poor yields, poor metal stack performance, being very expensive, and being too late for Apple’s 2022 iPhone. These can’t be confirmed, but we can confirm that TSMC N3 is now shipping in Q1 2023.
The hiccup on N3 brings many questions about TSMC’s competitive positioning versus Intel 20A and Samsung 2nm. Both these nodes are very aggressive and aimed at getting back into a competitive position against TSMC. Intel and Samsung even claim the nodes will bring leadership.
TechInsights released a die shot of the A15 and with the help of SkyJuice’s, we are analyzing it today. TheRead more
Apple’s leading CPU team looks to be struggling as they have now delivered no CPU gains for the first generation ever. Apple likely had to delay their next core architecture due due to personnel overturn from the Nuvia exodus. Furthermore, with a new exodus surrounding Rivos, the future doesn’t look so bright. Apple currently has the best client CPU cores, but can they hold this lead against stronger competition from Intel, AMD, and Qualcomm?Read more