ASML – SemiAnalysis

Can You Trust Semiconductor Capital Equipment Firms? Supply Chain Or Technology… Also Tracking Sheet With 106 Active Projects In Supply Chain

June 26, 2022June 29, 2022 Dylan Patel 0 Comments

Semiconductor capital equipment firms claim to have high visibility into the future. Given the complexity of manufacturing semiconductors, one would

ASML Logic TSMC

Die Size And Reticle Conundrum – Smaller Isn’t Always Better – Cost Model With Lithography Scanner Throughput

June 19, 2022June 19, 2022 Dylan Patel 0 Comments

A smaller die size isn’t always better. In fact, it can significantly increase your cost per wafer if special care isn’t give during the design process.

Applied Materials ASML Besi GlobalFoundries GlobalWafers KLIC Lam Research Logic Micron NAND NXP Packaging Samsung SK Hynix STMicroelectronics Sumco Texas Instruments Tokyo Electron TSMC YMTC

I, Semiconductor – The Regionalization Of Semiconductors Due To Global Supply Chain Instability

February 25, 2022February 28, 2022 Dylan Patel 2 Comments

Western fabs and semiconductor capital equipment spending to go bonkers

ASML Lyncean

ASML’s EUV Tools Have A Throughput Problem, But Lyncean Has The Answer By Scaling EUV Light Source Power An Order Of Magnitude

October 13, 2021June 20, 2022 Dylan Patel 1 Comment

A TSMC fab with 10 EUV machines running N3 wafers would only be capable of ~15,000 wafers per month at current power output and uptime rates. There is a major issue with EUV throughput, and Lyncean Technologies may have the solution.