ASML – SemiAnalysis

I, Semiconductor – The Regionalization Of Semiconductors Due To Global Supply Chain Instability

February 25, 2022February 28, 2022 Dylan Patel 2 Comments

Western fabs and semiconductor capital equipment spending to go bonkers

ASML Lyncean

ASML’s EUV Tools Have A Throughput Problem, But Lyncean Has The Answer By Scaling EUV Light Source Power An Order Of Magnitude

October 13, 2021October 13, 2021 Dylan Patel 1 Comment

A TSMC fab with 10 EUV machines running N3 wafers would only be capable of ~15,000 wafers per month at current power output and uptime rates. There is a major issue with EUV throughput, and Lyncean Technologies may have the solution.