In this article, we will discuss Ayar Labs funding, the core problem they are solving, and do a deep dive on their technology offering.Read more
They have numerous wins at Nvidia, Broadcom, Marvell, Cisco, Macom, Ayar Labs, Lightmatter, PsiQuantum, Ranovus, And Xanadu. In addition they are deeply integrated with the PDK and simulation toolchain with partnerships with Ansys, Cadence, and Synopsys.Read more
Western fabs and semiconductor capital equipment spending to go bonkersRead more
GlobalFoundries, Sumco, GlobalWafers, Power Integrations, FormFactor, Texas Instruments, Ichor, Ford, Kulicke and Soffa Industries, TSMC, Amazon, Skyworks, Qorvo, Qualcomm, Murata, Rambus, and RenesasRead more
Advanced packaging exists on a continuum of cost and throughput vs performance and density. Even though the demand for advanced packaging is obvious, there is an incredible number of advanced packaging types and brand names from Intel (EMIB, Foveros, Foveros Omni, Foveros Direct), TSMC (InFO-OS, InFO-LSI, InFO-SOW, InFO-SoIS, CoWoS-S, CoWoS-R, CoWoS-L, SoIC), Samsung (FOSiP, X-Cube, I-Cube, HBM, DDR/LPDDR DRAM, CIS), ASE (FoCoS, FOEB), Sony (CIS), Micron (HBM), SKHynix (HBM), and YMTC (XStacking). These packaging types are used by all of our favorite companies from AMD, Nvidia, and many more. In Part 2, we will explain all these types of packaging and their uses.Read more
Low utilization rates, countless divested assets, cut R&D and capex, and still doesn’t make money in the greatest semiconductor boom of all time.
Playing up on nationalism while having their largest fab and ongoing investment in Singapore.
Rather than chasing Moore’s Law while ignoring all cost scaling, GlobalFoundries is pushing the bleeding edge of manufacturing in silicon photonics, usage of materials such as SiN and GaN for communications, 3D heterogenous integration, and FD-SOIRead more