GlobalFoundries Fotonix, The Leading Silicon Photonics Foundry For Co-packaged Optics And Processing – Wins At Nvidia, Broadcom, Marvell, Cisco, Macom, Ayar Labs, Lightmatter, PsiQuantum, Ranovus, And Xanadu

They have numerous wins at Nvidia, Broadcom, Marvell, Cisco, Macom, Ayar Labs, Lightmatter, PsiQuantum, Ranovus, And Xanadu. In addition they are deeply integrated with the PDK and simulation toolchain with partnerships with Ansys, Cadence, and Synopsys.

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Semiconductor Roundup – GlobalFoundries, Sumco, GlobalWafers, Power Integrations, FormFactor, Texas Instruments, Ichor, Ford, Kulicke and Soffa Industries, TSMC, Amazon, Skyworks, Qorvo, Qualcomm, Murata, Rambus, and Renesas – 2/10/2022

GlobalFoundries, Sumco, GlobalWafers, Power Integrations, FormFactor, Texas Instruments, Ichor, Ford, Kulicke and Soffa Industries, TSMC, Amazon, Skyworks, Qorvo, Qualcomm, Murata, Rambus, and Renesas

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Advanced Packaging Part 2 – Review Of Options/Use From Intel, TSMC, Samsung, AMD, ASE, Sony, Micron, SKHynix, YMTC, Tesla, and Nvidia

Advanced packaging exists on a continuum of cost and throughput vs performance and density. Even though the demand for advanced packaging is obvious, there is an incredible number of advanced packaging types and brand names from Intel (EMIB, Foveros, Foveros Omni, Foveros Direct), TSMC (InFO-OS, InFO-LSI, InFO-SOW, InFO-SoIS, CoWoS-S, CoWoS­-R, CoWoS-L, SoIC), Samsung (FOSiP, X-Cube, I-Cube, HBM, DDR/LPDDR DRAM, CIS), ASE (FoCoS, FOEB), Sony (CIS), Micron (HBM), SKHynix (HBM), and YMTC (XStacking). These packaging types are used by all of our favorite companies from AMD, Nvidia, and many more. In Part 2, we will explain all these types of packaging and their uses.

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GlobalFoundries Is A Leading-Edge Foundry Despite Claims Otherwise

Rather than chasing Moore’s Law while ignoring all cost scaling, GlobalFoundries is pushing the bleeding edge of manufacturing in silicon photonics, usage of materials such as SiN and GaN for communications, 3D heterogenous integration, and FD-SOI

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