Intel – SemiAnalysis

Intel

Intel Cuts Fab Buildout by $4B To Pay Billions In Dividends – First Net Loss In Over 30 Years, Cutting Fab Buildouts, But “Committed To Growing The Dividend”

July 29, 2022July 29, 2022 Dylan Patel 0 Comments

First Net Loss In Over 30 Years, Cutting Fab Buildouts, But “Committed To Growing The Dividend”

AI Google Graphcore Intel Logic Nvidia

Nvidia In The Hot Seat? Intel Habana, Graphcore, Google TPU, and Nvidia A100 Compared In AI Training

June 29, 2022July 7, 2022 Dylan Patel 0 Comments

Intel Habana, Graphcore, Google TPU, and Nvidia A100 Compared In AI Training With MLPerf

AMD Applied Materials Besi DRAM Intel Lam Research Logic MediaTek Packaging Samsung Silicon Photonics SK Hynix Tokyo Electron TSMC

Packaging Developments From ECTC 2022 – TSMC CoWoS-R+, TSMC 4th Generation SoIC, Intel Collective Die To Wafer Hybrid Bonding, AMD V-Cache, Sony’s Leading 1-Micron Pitch Hybrid Bonding, MediaTek Networking SoC, Co-Packaged Optics, And More

June 8, 2022June 8, 2022 Dylan Patel 0 Comments

TSMC CoWoS-R+, TSMC 4th Generation SoIC, Intel Collective Die To Wafer Hybrid Bonding, AMD V-Cache, Sony’s Leading 1-Micron Pitch Hybrid Bonding, MediaTek Networking SoC, and Co-Packaged Optics

AMD Ampere Computing Intel

Is Ampere Computing’s Cloud Native Marketing Fluff? – Siryn Ampere One 5nm Architecture, Cost Analysis, and IPO Analysis

June 1, 2022July 25, 2022 Dylan Patel 0 Comments

We break through the marketing fluff of Ampere. We also did a cost comparison of Ampere’s Altra and Altra Max to AMD Milan and Intel Icelake. We also do a similar comparison with projected specs for the 5nm based Siryn. SemiAnalysis also details the architecture, including architecture diagrams, on Ampere One exclusively with the help of Cardyak,

Intel Logic Packaging

Meteor Lake Die Shot and Architecture Analysis – Why Is Intel 4 Only A 40% Area Reduction Versus Intel 7?

May 26, 2022July 26, 2022 Dylan Patel 0 Comments

Die shot analysis shows 40% area reduction on identical structures from Intel 7 to Intel 4. Analysis on Redwood Cove and Crestmont architecture, Foveros Omni, Intel’s use of TSMC N3 in the GPU, and SOC/IO chiplets

Intel

Turning The Titanic – How Intel Is Using Software Acquisitions And Increased Accountability To Attempt To Save The Sinking Ship

May 18, 2022May 18, 2022 Dylan Patel 0 Comments

It’s no secret that Intel has some rocky years ahead with AMD, Nvidia, Marvell, and in-housing efforts from the likes

Intel Nvidia

How Nvidia’s Empire Could Be Eroded – Intel Network And Edge Has The Playbook

April 6, 2022April 16, 2022 Dylan Patel 0 Comments

Nvidia’s software expertise has propelled them to completely dominating the markets they operate in. Intel Network and Edge Group has a successful playbook to fight back. They have come to dominate many areas of hardware with this playbook. In this post we will discuss the playbook in detail.

Intel

Intel Is Throwing The Kitchen Sink, But Is The Turn Around Plan Reasonable? | Deep Dive On Tower Semiconductor Fabs And IP, Intel Culture Shift, Future Product And Roadmap Competitiveness By Business Unit

February 18, 2022June 20, 2022 Dylan Patel 2 Comments

Deep Dive on Tower Semiconductor Fabs And IP, Intel Culture Shift, Future Product And Roadmap Competitiveness By Business Unit

Intel

Is Intel Shipping Tools Out Of US Fabs So They Can Abuse CHIPS Act Subsidies?

January 30, 2022January 31, 2022 Dylan Patel 1 Comment

Intel is shipping EUV photoresist Coater/Developer from Oregon to Ireland Fab 32. Meanwhile they are taking new delivery of the same tool in Oregon. Is Intel trying to abuse the CHIPS Act 40% tax credit?

Automotive Intel Lam Research Logic MediaTek Mobile Samsung Silicon Carbide Teradyne Texas Instruments

Semiconductor Roundup – Intel, Teradyne, Lam Research, Wolfspeed, Texas Instruments, UMC, Xilinx, Samsung, MediaTek – 1/27/2022

January 27, 2022January 31, 2022 Dylan Patel 4 Comments

This will be our first of this type of post, but a flurry of semiconductor earnings releases and calls are

← Previous