Nvidia’s software expertise has propelled them to completely dominating the markets they operate in. Intel Network and Edge Group has a successful playbook to fight back. They have come to dominate many areas of hardware with this playbook. In this post we will discuss the playbook in detail.Read more
Deep Dive on Tower Semiconductor Fabs And IP, Intel Culture Shift, Future Product And Roadmap Competitiveness By Business UnitRead more
Intel is shipping EUV photoresist Coater/Developer from Oregon to Ireland Fab 32. Meanwhile they are taking new delivery of the same tool in Oregon. Is Intel trying to abuse the CHIPS Act 40% tax credit?Read more
This will be our first of this type of post, but a flurry of semiconductor earnings releases and calls areRead more
Intel co-developed a thermocompression bonding tool which they own hundreds of. TCB is a key enabler in their advanced packaging strategy and a key differentiator versus their competition such as TSMC on a cost and integration basis.Read more
Advanced packaging exists on a continuum of cost and throughput vs performance and density. Even though the demand for advanced packaging is obvious, there is an incredible number of advanced packaging types and brand names from Intel (EMIB, Foveros, Foveros Omni, Foveros Direct), TSMC (InFO-OS, InFO-LSI, InFO-SOW, InFO-SoIS, CoWoS-S, CoWoS-R, CoWoS-L, SoIC), Samsung (FOSiP, X-Cube, I-Cube, HBM, DDR/LPDDR DRAM, CIS), ASE (FoCoS, FOEB), Sony (CIS), Micron (HBM), SKHynix (HBM), and YMTC (XStacking). These packaging types are used by all of our favorite companies from AMD, Nvidia, and many more. In Part 2, we will explain all these types of packaging and their uses.Read more
People all over semiconductor world have been speculating about the TSMC and Intel deal. SemiAnalysis wants to set the record straight on these. We are going to dive into the details for wafer supply agreements including prepayment terms and capacity agreements for AMD, Apple, Broadcom, Intel, MediaTek, Nvidia, and Qualcomm.Read more
In this multi-part series we will do a deep dive into the advanced packaging mega-trend. This will include a breakdown of the various types of advanced packaging, flows, tool types, and vendors. In part 1 we dive into what pad limited designs are, the slowdown of Moore’s Law and end of economic shrinks, heterogeneous compute, and the economic and design implications of chiplets.Read more
Shots are being fired at merchant silicon.
Amazon’s Graviton3 completely commoditizes generalized CPU compute while also bringing advanced packaging, PCIe 5.0, and DDR5 to the server market ~6 months before Intel and AMD.
Server and rack level system architecture choices propel Graviton 3 to new heights in cost per unit of compute.
There’s something special about the packaging behind the paywall.
Intel could follow the path of many other American goliaths such as IBM and General Electric. A slow slide to irrelevancy, spinning off business, and bringing shame to what was once pride for American ingenuity. Instead of that conservative route, they are going to put the metal to the floor, spend every dime Intel makes on investing in more manufacturing, design, and in general catching up in technology.Read more