Amazon Graviton 3 Uses Chiplets & Advanced Packaging To Commoditize High Performance CPUs | The First PCIe 5.0 And DDR5 Server CPU

Shots are being fired at merchant silicon.
Amazon’s Graviton3 completely commoditizes generalized CPU compute while also bringing advanced packaging, PCIe 5.0, and DDR5 to the server market ~6 months before Intel and AMD.
Server and rack level system architecture choices propel Graviton 3 to new heights in cost per unit of compute.
There’s something special about the packaging behind the paywall.

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Intel Betting The Farm – Shrinking Business, Margins Down For Few Years, But Aggressively Investing $40B-$43B A Year And More With Subsidies

Intel could follow the path of many other American goliaths such as IBM and General Electric. A slow slide to irrelevancy, spinning off business, and bringing shame to what was once pride for American ingenuity. Instead of that conservative route, they are going to put the metal to the floor, spend every dime Intel makes on investing in more manufacturing, design, and in general catching up in technology.

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TSMC 3nm Wafer Shipments Pushed Into Q1 2023, 2.5 Years After N5 | TSMC 2nm, Samsung 2nm, And Intel 20A Battle It Out In 2025

SemiAnalysis has been hearing murmurings about TSMC’s N3 having poor yields, poor metal stack performance, being very expensive, and being too late for Apple’s 2022 iPhone. These can’t be confirmed, but we can confirm that TSMC N3 is now shipping in Q1 2023.
The hiccup on N3 brings many questions about TSMC’s competitive positioning versus Intel 20A and Samsung 2nm. Both these nodes are very aggressive and aimed at getting back into a competitive position against TSMC. Intel and Samsung even claim the nodes will bring leadership.

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Aehr Multi-Wafer Level Burn-in Test for Silicon Carbide and Silicon Photonics Applications

Test intensity for silicon carbide and photonics is very high due to extreme operating ranges. Wafer level burn in could transform the test life cycle for semiconductors. Major wins such as On Semiconductor and Intel validate this.

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Intel Grossly Exaggerates Foundry “Wins” With Qualcomm And Amazon, There Are No Deals For Manufacturing Chips

Intel touted huge wins with Qualcomm and Amazon for their foundry business, but a deeper investigation reveals there are no chips deals penned. Intel will only package for Amazon, and Qualcomm is only evaluating the technology.

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Intel’s Trojan Horse into the Foundry Business | Co-packaged Silicon Photonics is Intel’s Path Forward for IDM 2.0

Intel is struggling against TSMC, AMD, Apple, Nvidia, Amazon, etc.
They have a potential ace which would allow them to remain at the heart of datacenter and force industry dependency.
Co-packaged silicon photonics is Intel’s Trojan Horse into the foundry business!

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