KLIC

Amazon Ford FormFactor GlobalFoundries GlobalWafers Ichor KLIC Murata Power Integrations Qorvo Qualcomm Rambus Renesas Skyworks Sumco Texas Instruments TSMC 

Semiconductor Roundup – GlobalFoundries, Sumco, GlobalWafers, Power Integrations, FormFactor, Texas Instruments, Ichor, Ford, Kulicke and Soffa Industries, TSMC, Amazon, Skyworks, Qorvo, Qualcomm, Murata, Rambus, and Renesas – 2/10/2022

Dylan Patel 0 Comments

GlobalFoundries, Sumco, GlobalWafers, Power Integrations, FormFactor, Texas Instruments, Ichor, Ford, Kulicke and Soffa Industries, TSMC, Amazon, Skyworks, Qorvo, Qualcomm, Murata, Rambus, and Renesas

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ASM Pacific Besi Intel KLIC Logic Packaging 

Advanced Packaging Part 3 – Intel’s Curious Bet on Thermocompression Bonding, ASM Pacific, Kulicke and Soffa, and Besi TCB Tool Landscape

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Intel co-developed a thermocompression bonding tool which they own hundreds of. TCB is a key enabler in their advanced packaging strategy and a key differentiator versus their competition such as TSMC on a cost and integration basis.

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AMD Apple Applied Materials DRAM GlobalFoundries Intel KLIC Logic Micron NAND Nvidia Packaging Samsung Tesla TSMC YMTC 

Advanced Packaging Part 2 – Review Of Options/Use From Intel, TSMC, Samsung, AMD, ASE, Sony, Micron, SKHynix, YMTC, Tesla, and Nvidia

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Advanced packaging exists on a continuum of cost and throughput vs performance and density. Even though the demand for advanced packaging is obvious, there is an incredible number of advanced packaging types and brand names from Intel (EMIB, Foveros, Foveros Omni, Foveros Direct), TSMC (InFO-OS, InFO-LSI, InFO-SOW, InFO-SoIS, CoWoS-S, CoWoS­-R, CoWoS-L, SoIC), Samsung (FOSiP, X-Cube, I-Cube, HBM, DDR/LPDDR DRAM, CIS), ASE (FoCoS, FOEB), Sony (CIS), Micron (HBM), SKHynix (HBM), and YMTC (XStacking). These packaging types are used by all of our favorite companies from AMD, Nvidia, and many more. In Part 2, we will explain all these types of packaging and their uses.

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AMD Apple Intel KLIC Logic Mobile Nvidia Packaging TSMC 

Advanced Packaging Part 1 – Pad Limited Designs, Breakdown Of Economic Semiconductor Scaling, Heterogeneous Compute, and Chiplets

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In this multi-part series we will do a deep dive into the advanced packaging mega-trend. This will include a breakdown of the various types of advanced packaging, flows, tool types, and vendors. In part 1 we dive into what pad limited designs are, the slowdown of Moore’s Law and end of economic shrinks, heterogeneous compute, and the economic and design implications of chiplets.

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KLIC Packaging 

Kulicke & Soffa Industries, $KLIC, Continued Outperformance Of Wire Bonders And Emerging Supplier in Mini-LED, Micro-LED, And Battery Manufacturing

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Kulicke and Soffa Industries is continuing to outperform on the back of the wire bonder business. Additionally, they are emerging as a leading supplier in tools used for mini-LED, micro-LED, and battery manufacturing.

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KLIC Logic Packaging 

Kulicke & Soffa Industries, $KLIC, Crushes Earnings But Continues To Sandbag, $6 EPS ’21, $6.75 EPS ’22

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SemiAnalysis has been clamoring about $KLIC for nearly a year on Twitter and backchannels, and after outsized beats, we are even more bullish. Even after the recent run up, it is currently trading at about 10x SemiAnalysis’s 2021 Projected EPS ($6). This is above Wall Street consensus, but there is room for this estimate to be beaten. 2022 Projected EPS is $6.75.

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