Lam Research Is Outsourcing More Than 1/3 Of Their Manufacturing To Malaysia

The US will continue to lose semiconductors, not only in chip manufacturing, but also in the expertise related to tool production. Furthermore, rather than going to low cost allies of the US, a huge national security hole is being opened. The pro-CCP government of Malaysia is a huge beneficiary of the movement of some of the highest tech manufacturing in the world. We can’t fault Lam Research for the move as it’s clearly driven by US policy failures on tax, education, and manufacturing, but we do want to bring attention of this to our readers.

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Packaging Developments From ECTC 2022 – TSMC CoWoS-R+, TSMC 4th Generation SoIC, Intel Collective Die To Wafer Hybrid Bonding, AMD V-Cache, Sony’s Leading 1-Micron Pitch Hybrid Bonding, MediaTek Networking SoC, Co-Packaged Optics, And More

TSMC CoWoS-R+, TSMC 4th Generation SoIC, Intel Collective Die To Wafer Hybrid Bonding, AMD V-Cache, Sony’s Leading 1-Micron Pitch Hybrid Bonding, MediaTek Networking SoC, and Co-Packaged Optics

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Lam Research, Tokyo Electron, JSR Battle It Out In The $5B+ EUV Photoresist, Coater, and Developer Market – CAR vs MOR vs Dry Resist

There is a battle brewing in the photoresist, coater, and developer market due to EUV advancement. This battle could cost Tokyo Electron their dominance over a $5B+ annual revenue market and lead to some photoresist companies such as TOK to lose a major market. JSR and Tokyo are bringing Metal Oxide Resist (MOR) to the market to fight off Lam Research’s encroachment with their dry resist technology.

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