MediaTek – SemiAnalysis

Packaging Developments From ECTC 2022 – TSMC CoWoS-R+, TSMC 4th Generation SoIC, Intel Collective Die To Wafer Hybrid Bonding, AMD V-Cache, Sony’s Leading 1-Micron Pitch Hybrid Bonding, MediaTek Networking SoC, Co-Packaged Optics, And More

June 8, 2022June 8, 2022 Dylan Patel 0 Comments

TSMC CoWoS-R+, TSMC 4th Generation SoIC, Intel Collective Die To Wafer Hybrid Bonding, AMD V-Cache, Sony’s Leading 1-Micron Pitch Hybrid Bonding, MediaTek Networking SoC, and Co-Packaged Optics

Automotive Intel Lam Research Logic MediaTek Mobile Samsung Silicon Carbide Teradyne Texas Instruments

Semiconductor Roundup – Intel, Teradyne, Lam Research, Wolfspeed, Texas Instruments, UMC, Xilinx, Samsung, MediaTek – 1/27/2022

January 27, 2022January 31, 2022 Dylan Patel 4 Comments

This will be our first of this type of post, but a flurry of semiconductor earnings releases and calls are

AMD Apple Broadcom Intel Logic MediaTek Nvidia Qualcomm

TSMC Wants To Make Intel Dependent On External Manufacturing – Wafer Supply Agreement Insights For AMD, Apple, Broadcom, Intel, MediaTek, Nvidia, and Qualcomm

December 22, 2021December 27, 2021 Dylan Patel 0 Comments Intel 20A, Intel 4, Intel 7, Long Term Supply Agreements, N3, N3E, N4, N4P, N5, N5P, N6, N7, Pre-Paid Capacity, Wafer Supply Agreement

People all over semiconductor world have been speculating about the TSMC and Intel deal. SemiAnalysis wants to set the record straight on these. We are going to dive into the details for wafer supply agreements including prepayment terms and capacity agreements for AMD, Apple, Broadcom, Intel, MediaTek, Nvidia, and Qualcomm.

Logic MediaTek Mobile Qualcomm TSMC

MediaTek Officially Enters The Flagship Mobile Race With The First TSMC 4nm SOC

July 28, 2021August 3, 2021 Dylan Patel 0 Comments 3GPP Release 16, 3nm, 4nm, 5nm, 6nm, A510, A710, Dimensity 2000, Flagship Mobile, GPP Release 16, Mediatek, mmWave, N3, N4, N5, N6, SOC, X2

MediaTek is targeting the flagship mobile world next year by shipping the highest density node, TSMC 4nm before anyone else. They will utilize the best standard Armv9 cores with X2, A710, and A510. It will also bring 5G GPP Release 16 support. MediaTek may snatch the Android CPU crown away from Qualcomm and Samsung!

Apple Logic MediaTek Mobile Qualcomm

Qualcomm/MediaTek Will Beat Apple To Shipping TSMC 3nm Based Smartphone Chips

July 26, 2021August 3, 2021 Dylan Patel 1 Comment A16, Apple, Dimensity, Mediatek, N3, Qualcomm, S895

Apple has long been considered the primary TSMC partner as the first mover to new process technologies, but this is changing.
Based on comments from TSMC’s CEO, Qualcomm and/or MediaTek will be releasing a N3 smartphone SOC before Apple!

Logic MediaTek Mobile

Mediatek Stands to Gain the Most from the New Cold War

May 22, 2020August 3, 2021 Dylan Patel 2 Comments China, Huawei, Mediatek, Qualcomm

The new cold war between the US and China is heating up again with Huawei being banned from having their