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People all over semiconductor world have been speculating about the TSMC and Intel deal. SemiAnalysis wants to set the record straight on these. We are going to dive into the details for wafer supply agreements including prepayment terms and capacity agreements for AMD, Apple, Broadcom, Intel, MediaTek, Nvidia, and Qualcomm.
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MediaTek is targeting the flagship mobile world next year by shipping the highest density node, TSMC 4nm before anyone else. They will utilize the best standard Armv9 cores with X2, A710, and A510. It will also bring 5G GPP Release 16 support. MediaTek may snatch the Android CPU crown away from Qualcomm and Samsung!
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Apple has long been considered the primary TSMC partner as the first mover to new process technologies, but this is changing.
Based on comments from TSMC’s CEO, Qualcomm and/or MediaTek will be releasing a N3 smartphone SOC before Apple!
The new cold war between the US and China is heating up again with Huawei being banned from having their
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