Nvidia Ada Lovelace Leaked Specifications, Die Sizes, Architecture, Cost, And Performance Analysis
In depth breakdown of Nvidia’s Lovelace including architecture, die size, cost, and performance.
Read moreIn depth breakdown of Nvidia’s Lovelace including architecture, die size, cost, and performance.
Read moreNvidia’s software expertise has propelled them to completely dominating the markets they operate in. Intel Network and Edge Group has a successful playbook to fight back. They have come to dominate many areas of hardware with this playbook. In this post we will discuss the playbook in detail.
Read moreThis article was originally published on March 23rd via the SemiAnalysis newsletter. A long-time supplier of Nvidia has seemingly been
Read moreThey have numerous wins at Nvidia, Broadcom, Marvell, Cisco, Macom, Ayar Labs, Lightmatter, PsiQuantum, Ranovus, And Xanadu. In addition they are deeply integrated with the PDK and simulation toolchain with partnerships with Ansys, Cadence, and Synopsys.
Read moreThe hack contains sensitive info on future GPU configurations, source code for software, tester, simulation, and Verilog code.
This could be the most significant act of corporate espionage in a generation.
Advanced packaging exists on a continuum of cost and throughput vs performance and density. Even though the demand for advanced packaging is obvious, there is an incredible number of advanced packaging types and brand names from Intel (EMIB, Foveros, Foveros Omni, Foveros Direct), TSMC (InFO-OS, InFO-LSI, InFO-SOW, InFO-SoIS, CoWoS-S, CoWoS-R, CoWoS-L, SoIC), Samsung (FOSiP, X-Cube, I-Cube, HBM, DDR/LPDDR DRAM, CIS), ASE (FoCoS, FOEB), Sony (CIS), Micron (HBM), SKHynix (HBM), and YMTC (XStacking). These packaging types are used by all of our favorite companies from AMD, Nvidia, and many more. In Part 2, we will explain all these types of packaging and their uses.
Read morePeople all over semiconductor world have been speculating about the TSMC and Intel deal. SemiAnalysis wants to set the record straight on these. We are going to dive into the details for wafer supply agreements including prepayment terms and capacity agreements for AMD, Apple, Broadcom, Intel, MediaTek, Nvidia, and Qualcomm.
Read moreIn this multi-part series we will do a deep dive into the advanced packaging mega-trend. This will include a breakdown of the various types of advanced packaging, flows, tool types, and vendors. In part 1 we dive into what pad limited designs are, the slowdown of Moore’s Law and end of economic shrinks, heterogeneous compute, and the economic and design implications of chiplets.
Read moreTesla has flipped the hardware world on its head by creating a chip with GPU levels of compute, more than the highest end networking chips IO, and high levels of flexibility. They utilize a integrated fan out system on wafer that achieves better scale up and scale out performance than Nvidia, Graphcore, Cerebras, Groq, Tenstorrent, SambaNova, or any other AI training startup.
Read moreNvidia is a leader and visionary in the industry, but their stock price has ran far ahead of the business fundamentals. Their current stock price shows eerie similarities to other bubbles that came before!
Banks and retail investors are over-extrapolating outsized growth.