Ada Lovelace GPUs Shows How Desperate Nvidia Is – AMD RDNA 3 Cost Comparison – Nvidia’s first cost disadvantage versus AMD in a decade
Nvidia’s first cost disadvantage versus AMD in a decade
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Nvidia
Meta Discusses AI Hardware and Co-packaged Optics – Nvidia Is Playing A Different Ball Game
Nvidia Is Playing A Different Ball Game
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How Intel Was Designed Into The Majority Of Next Generation 51.2T Ethernet Switch Platforms – Broadcom Tomahawk 5, Cisco Silicon One, Nvidia Spectrum-4, Marvell Teralynx 9, Intel Tofino 4
Broadcom Tomahawk 5, Cisco Silicon One, Nvidia Spectrum-4, Marvell Teralynx 9, Intel Tofino 4
Read moreNvidia In The Hot Seat? Intel Habana, Graphcore, Google TPU, and Nvidia A100 Compared In AI Training
Intel Habana, Graphcore, Google TPU, and Nvidia A100 Compared In AI Training With MLPerf
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Nvidia Ada Lovelace Leaked Specifications, Die Sizes, Architecture, Cost, And Performance Analysis
In depth breakdown of Nvidia’s Lovelace including architecture, die size, cost, and performance.
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How Nvidia’s Empire Could Be Eroded – Intel Network And Edge Has The Playbook
Nvidia’s software expertise has propelled them to completely dominating the markets they operate in. Intel Network and Edge Group has a successful playbook to fight back. They have come to dominate many areas of hardware with this playbook. In this post we will discuss the playbook in detail.
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Short Report: Nvidia Supplier Cut Out Of Next Generation Hopper GPUs – Nvidia Represents Up To 55% of Revenue
This article was originally published on March 23rd via the SemiAnalysis newsletter. A long-time supplier of Nvidia has seemingly been
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GlobalFoundries Fotonix, The Leading Silicon Photonics Foundry For Co-packaged Optics And Processing – Wins At Nvidia, Broadcom, Marvell, Cisco, Macom, Ayar Labs, Lightmatter, PsiQuantum, Ranovus, And Xanadu
They have numerous wins at Nvidia, Broadcom, Marvell, Cisco, Macom, Ayar Labs, Lightmatter, PsiQuantum, Ranovus, And Xanadu. In addition they are deeply integrated with the PDK and simulation toolchain with partnerships with Ansys, Cadence, and Synopsys.
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Nvidia Hacked – A National Security Disaster
The hack contains sensitive info on future GPU configurations, source code for software, tester, simulation, and Verilog code.
This could be the most significant act of corporate espionage in a generation.
Advanced Packaging Part 2 – Review Of Options/Use From Intel, TSMC, Samsung, AMD, ASE, Sony, Micron, SKHynix, YMTC, Tesla, and Nvidia
Advanced packaging exists on a continuum of cost and throughput vs performance and density. Even though the demand for advanced packaging is obvious, there is an incredible number of advanced packaging types and brand names from Intel (EMIB, Foveros, Foveros Omni, Foveros Direct), TSMC (InFO-OS, InFO-LSI, InFO-SOW, InFO-SoIS, CoWoS-S, CoWoS-R, CoWoS-L, SoIC), Samsung (FOSiP, X-Cube, I-Cube, HBM, DDR/LPDDR DRAM, CIS), ASE (FoCoS, FOEB), Sony (CIS), Micron (HBM), SKHynix (HBM), and YMTC (XStacking). These packaging types are used by all of our favorite companies from AMD, Nvidia, and many more. In Part 2, we will explain all these types of packaging and their uses.
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