Tesla Dojo – Unique Packaging and Chip Design Allow An Order Magnitude Advantage Over Competing AI Hardware

Tesla has flipped the hardware world on its head by creating a chip with GPU levels of compute, more than the highest end networking chips IO, and high levels of flexibility. They utilize a integrated fan out system on wafer that achieves better scale up and scale out performance than Nvidia, Graphcore, Cerebras, Groq, Tenstorrent, SambaNova, or any other AI training startup.

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Intel’s Trojan Horse into the Foundry Business | Co-packaged Silicon Photonics is Intel’s Path Forward for IDM 2.0

Intel is struggling against TSMC, AMD, Apple, Nvidia, Amazon, etc.
They have a potential ace which would allow them to remain at the heart of datacenter and force industry dependency.
Co-packaged silicon photonics is Intel’s Trojan Horse into the foundry business!

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