Qualcomm RFFE Update – $8B By 2025, 2023 iPhone Modem, WiFi 7 and Filter Socket Competition With Broadcom, $3B Automotive RF TAM
$8B By 2025, 2023 iPhone Modem, WiFi 7 and Filter Socket Competition With Broadcom, $3B Automotive RF TAM
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Corporate
Can You Trust Semiconductor Capital Equipment Firms? Supply Chain Or Technology… Also Tracking Sheet With 106 Active Projects In Supply Chain
Semiconductor capital equipment firms claim to have high visibility into the future. Given the complexity of manufacturing semiconductors, one would
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Die Size And Reticle Conundrum – Smaller Isn’t Always Better – Cost Model With Lithography Scanner Throughput
A smaller die size isn’t always better. In fact, it can significantly increase your cost per wafer if special care isn’t give during the design process.
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AMD – To Infinity And Beyond
Infinity Fabric 4 and custom silicon, CDNA 3 MI300 specifications, AMD CPU area efficiency, XDNA and AIE, and 2023 EPS estimates
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Why America Will Lose Semiconductors – Tangible bi-partisan solutions for solving a national security crisis
Tangible bi-partisan solutions for solving a national security crisis.
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Apple M2 Die Shot and Architecture Analysis – Big Cost Increase And A15 Based IP
Apple announced their new 20 billion transistor M2 SoC at WWDC. Unfortunately, it’s quite a minor uplift in performance in
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Packaging Developments From ECTC 2022 – TSMC CoWoS-R+, TSMC 4th Generation SoIC, Intel Collective Die To Wafer Hybrid Bonding, AMD V-Cache, Sony’s Leading 1-Micron Pitch Hybrid Bonding, MediaTek Networking SoC, Co-Packaged Optics, And More
TSMC CoWoS-R+, TSMC 4th Generation SoIC, Intel Collective Die To Wafer Hybrid Bonding, AMD V-Cache, Sony’s Leading 1-Micron Pitch Hybrid Bonding, MediaTek Networking SoC, and Co-Packaged Optics
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Is Ampere Computing’s Cloud Native Marketing Fluff? – Siryn Ampere One 5nm Architecture, Cost Analysis, and IPO Analysis
We break through the marketing fluff of Ampere. We also did a cost comparison of Ampere’s Altra and Altra Max to AMD Milan and Intel Icelake. We also do a similar comparison with projected specs for the 5nm based Siryn. SemiAnalysis also details the architecture, including architecture diagrams, on Ampere One exclusively with the help of Cardyak,
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Meteor Lake Die Shot and Architecture Analysis – Why Is Intel 4 Only A 40% Area Reduction Versus Intel 7?
Die shot analysis shows 40% area reduction on identical structures from Intel 7 to Intel 4. Analysis on Redwood Cove and Crestmont architecture, Foveros Omni, Intel’s use of TSMC N3 in the GPU, and SOC/IO chiplets
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Turning The Titanic – How Intel Is Using Software Acquisitions And Increased Accountability To Attempt To Save The Sinking Ship
It’s no secret that Intel has some rocky years ahead with AMD, Nvidia, Marvell, and in-housing efforts from the likes
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