Semiconductor Roundup – GlobalFoundries, Sumco, GlobalWafers, Power Integrations, FormFactor, Texas Instruments, Ichor, Ford, Kulicke and Soffa Industries, TSMC, Amazon, Skyworks, Qorvo, Qualcomm, Murata, Rambus, and Renesas – 2/10/2022

GlobalFoundries, Sumco, GlobalWafers, Power Integrations, FormFactor, Texas Instruments, Ichor, Ford, Kulicke and Soffa Industries, TSMC, Amazon, Skyworks, Qorvo, Qualcomm, Murata, Rambus, and Renesas

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TSMC Wants To Make Intel Dependent On External Manufacturing – Wafer Supply Agreement Insights For AMD, Apple, Broadcom, Intel, MediaTek, Nvidia, and Qualcomm

People all over semiconductor world have been speculating about the TSMC and Intel deal. SemiAnalysis wants to set the record straight on these. We are going to dive into the details for wafer supply agreements including prepayment terms and capacity agreements for AMD, Apple, Broadcom, Intel, MediaTek, Nvidia, and Qualcomm.

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Qualcomm RFFE Business Continues Relentless Pace With ultraBAW Filters | >$8B Segment By 2025

Qualcomm continues to accelerate their RFFE business by filling more gaps in their product line and building out more capabilities for 5G. With ultraSAW, ultraBAW, and other innovations in filters, modules, envelope trackers, and switches, Qualcomm will likely grow RFFE to $8B in 2025.

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Intel Grossly Exaggerates Foundry “Wins” With Qualcomm And Amazon, There Are No Deals For Manufacturing Chips

Intel touted huge wins with Qualcomm and Amazon for their foundry business, but a deeper investigation reveals there are no chips deals penned. Intel will only package for Amazon, and Qualcomm is only evaluating the technology.

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MediaTek Officially Enters The Flagship Mobile Race With The First TSMC 4nm SOC

MediaTek is targeting the flagship mobile world next year by shipping the highest density node, TSMC 4nm before anyone else. They will utilize the best standard Armv9 cores with X2, A710, and A510. It will also bring 5G GPP Release 16 support. MediaTek may snatch the Android CPU crown away from Qualcomm and Samsung!

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Samsung Foundry 3nm Gate All Around Process Node, 3GAE, Delayed To As Late As 2024

Samsung Foundry 3nm Gate All Around Process Node, 3GAE, Delayed to 2024! This would arrive in a similar time frame to TSMC’s denser 2nm GAA technology.
Samsung and Intel continue to slip further behind TSMC in leading edge technology. Will they ever be able to catch up?

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Qualcomm MWC 2021 – Network Infrastructure And Edge 5G Get Supercharged | FSM200, DU X100 Accelerator, And Range Of Features

Qualcomm is changing the game in network infrastructure hardware with their 4nm FSM200 for small cells and the 5G Distributed Unit X100 Accelerator Card. Furthermore, their new features in 5G enable brand new use cases in automotive, factories, and supply chain!

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Qualcomm Hits a Homerun AI 100 – Powerful AI Inference Acceleration For the Edge

Qualcomm has hit a home run with the Cloud AI 100 because they truly understand the hardware and software co-design required in the AI space.
According to SemiAnalysis, this combo has landed Qualcomm a Super 7 Hyperscaler win in addition to a myriad of wins in the edge market.

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