Samsung Electronics has a culture problem that has shaken it to its core. Samsung is slipping on all aspects of technology development including the one area they have historically crushed all competitors, DRAM.Read more
Western fabs and semiconductor capital equipment spending to go bonkersRead more
This will be our first of this type of post, but a flurry of semiconductor earnings releases and calls areRead more
Advanced packaging exists on a continuum of cost and throughput vs performance and density. Even though the demand for advanced packaging is obvious, there is an incredible number of advanced packaging types and brand names from Intel (EMIB, Foveros, Foveros Omni, Foveros Direct), TSMC (InFO-OS, InFO-LSI, InFO-SOW, InFO-SoIS, CoWoS-S, CoWoS-R, CoWoS-L, SoIC), Samsung (FOSiP, X-Cube, I-Cube, HBM, DDR/LPDDR DRAM, CIS), ASE (FoCoS, FOEB), Sony (CIS), Micron (HBM), SKHynix (HBM), and YMTC (XStacking). These packaging types are used by all of our favorite companies from AMD, Nvidia, and many more. In Part 2, we will explain all these types of packaging and their uses.Read more
SemiAnalysis has been hearing murmurings about TSMC’s N3 having poor yields, poor metal stack performance, being very expensive, and being too late for Apple’s 2022 iPhone. These can’t be confirmed, but we can confirm that TSMC N3 is now shipping in Q1 2023.
The hiccup on N3 brings many questions about TSMC’s competitive positioning versus Intel 20A and Samsung 2nm. Both these nodes are very aggressive and aimed at getting back into a competitive position against TSMC. Intel and Samsung even claim the nodes will bring leadership.
YMTC 128 Layer NAND is the first semiconductor where China is technologically competitive with the leading edge firms from the Western sphere of influence.
Yields are improving and the 2nd fab is being filled with equipment. Once that milestone is reached, the 3rd and 4th fab will be built simultaneously.
NXP Semiconductor CFO sells nearly 70% of his shares as Samsung acquisition rumored to fall apart!
Kelly Peter sold 142,311 of his 203,749 shares.
Maybe there is another, completely justifiable reason he needed $32M all at once, but SemiAnalysis did not find one.
Samsung Foundry 3nm Gate All Around Process Node, 3GAE, Delayed to 2024! This would arrive in a similar time frame to TSMC’s denser 2nm GAA technology.
Samsung and Intel continue to slip further behind TSMC in leading edge technology. Will they ever be able to catch up?