Packaging Developments From ECTC 2022 – TSMC CoWoS-R+, TSMC 4th Generation SoIC, Intel Collective Die To Wafer Hybrid Bonding, AMD V-Cache, Sony’s Leading 1-Micron Pitch Hybrid Bonding, MediaTek Networking SoC, Co-Packaged Optics, And More

TSMC CoWoS-R+, TSMC 4th Generation SoIC, Intel Collective Die To Wafer Hybrid Bonding, AMD V-Cache, Sony’s Leading 1-Micron Pitch Hybrid Bonding, MediaTek Networking SoC, and Co-Packaged Optics

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Lam Research, Tokyo Electron, JSR Battle It Out In The $5B+ EUV Photoresist, Coater, and Developer Market – CAR vs MOR vs Dry Resist

There is a battle brewing in the photoresist, coater, and developer market due to EUV advancement. This battle could cost Tokyo Electron their dominance over a $5B+ annual revenue market and lead to some photoresist companies such as TOK to lose a major market. JSR and Tokyo are bringing Metal Oxide Resist (MOR) to the market to fight off Lam Research’s encroachment with their dry resist technology.

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