TSMC – SemiAnalysis

TSMC 3nm Wafer Shipments Pushed Into Q1 2023, 2.5 Years After N5 | TSMC 2nm, Samsung 2nm, And Intel 20A Battle It Out In 2025

October 14, 2021October 14, 2021 Dylan Patel 2 Comments

SemiAnalysis has been hearing murmurings about TSMC’s N3 having poor yields, poor metal stack performance, being very expensive, and being too late for Apple’s 2022 iPhone. These can’t be confirmed, but we can confirm that TSMC N3 is now shipping in Q1 2023.
The hiccup on N3 brings many questions about TSMC’s competitive positioning versus Intel 20A and Samsung 2nm. Both these nodes are very aggressive and aimed at getting back into a competitive position against TSMC. Intel and Samsung even claim the nodes will bring leadership.

AI Logic Packaging Tesla TSMC

Tesla AI Day Supercomputer Chip Teaser | Is This The First Deployment Of TSMC InFO_SoW?

August 4, 2021August 5, 2021 Dylan Patel 4 Comments Dojo, InFO_SOW, System On Wafer, Tesla

Tesla is known for having their own silicon strategy for their automobiles and was rumored to be working on a AI training chip for their own datacenter use cases as well. An image of this chip was posted and it is quite bizarre. It looks like it could be the first TSMC InFO_SoW product.

Logic MediaTek Mobile Qualcomm TSMC

MediaTek Officially Enters The Flagship Mobile Race With The First TSMC 4nm SOC

July 28, 2021August 3, 2021 Dylan Patel 0 Comments 3GPP Release 16, 3nm, 4nm, 5nm, 6nm, A510, A710, Dimensity 2000, Flagship Mobile, GPP Release 16, Mediatek, mmWave, N3, N4, N5, N6, SOC, X2

MediaTek is targeting the flagship mobile world next year by shipping the highest density node, TSMC 4nm before anyone else. They will utilize the best standard Armv9 cores with X2, A710, and A510. It will also bring 5G GPP Release 16 support. MediaTek may snatch the Android CPU crown away from Qualcomm and Samsung!

Logic TSMC

Morgan Stanley Just Reduced TSMC’s Value By $25B While Demonstrating A Complete Lack of Semiconductor Knowledge

June 23, 2021August 3, 2021 Dylan Patel 1 Comment $TSM, 3D Packaging, AMAT, Apple, ASML, Infineon, Morgan Stanley, Nvidia, Transistor Cost, TSMC, Wafer Prices

Morgan Stanley has downgraded TSMC $TSM in a blubbering 83-page report which caused its valuation to tumble by $25 billion. This report is full of errors and falsehoods. SemiAnalysis dissects some of these glaring mistakes.

Intel Logic Nvidia Silicon Photonics TSMC

Intel’s Trojan Horse into the Foundry Business | Co-packaged Silicon Photonics is Intel’s Path Forward for IDM 2.0

June 11, 2021August 3, 2021 Dylan Patel 3 Comments Barefoot, Barefoot Tofino, Co-packaged Optics, ICF, IDM 2.0, Intel, Intel Custom Foundry, Nvidia, Optical Trancievers, Photonic Engine, Silicon Photonics, TensTorrent, Tofinio 2, Wormhole

Intel is struggling against TSMC, AMD, Apple, Nvidia, Amazon, etc.
They have a potential ace which would allow them to remain at the heart of datacenter and force industry dependency.
Co-packaged silicon photonics is Intel’s Trojan Horse into the foundry business!

Apple Corporate Logic TSMC

Apple’s A14 Packs 134 Million Transistors/mm², but Falls Short of TSMC’s Density Claims

October 27, 2020August 3, 2021 Dylan Patel 62 Comments 3D SRAM, ICmasters, N5, N7, SRAM, Stacked SRAM, TSMC, Wafer Pricing

Our friends over at ICmasters have delved into the package of the Apple A14 Bionic. The die size has been