Advanced Packaging Part 2 – Review Of Options/Use From Intel, TSMC, Samsung, AMD, ASE, Sony, Micron, SKHynix, YMTC, Tesla, and Nvidia

Advanced packaging exists on a continuum of cost and throughput vs performance and density. Even though the demand for advanced packaging is obvious, there is an incredible number of advanced packaging types and brand names from Intel (EMIB, Foveros, Foveros Omni, Foveros Direct), TSMC (InFO-OS, InFO-LSI, InFO-SOW, InFO-SoIS, CoWoS-S, CoWoS­-R, CoWoS-L, SoIC), Samsung (FOSiP, X-Cube, I-Cube, HBM, DDR/LPDDR DRAM, CIS), ASE (FoCoS, FOEB), Sony (CIS), Micron (HBM), SKHynix (HBM), and YMTC (XStacking). These packaging types are used by all of our favorite companies from AMD, Nvidia, and many more. In Part 2, we will explain all these types of packaging and their uses.

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Lam Research, Tokyo Electron, JSR Battle It Out In The $5B+ EUV Photoresist, Coater, and Developer Market – CAR vs MOR vs Dry Resist

There is a battle brewing in the photoresist, coater, and developer market due to EUV advancement. This battle could cost Tokyo Electron their dominance over a $5B+ annual revenue market and lead to some photoresist companies such as TOK to lose a major market. JSR and Tokyo are bringing Metal Oxide Resist (MOR) to the market to fight off Lam Research’s encroachment with their dry resist technology.

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Fears for Chinese Semiconductor Capital Equipment and Chemical Supply Chain Are Overblown | Cautionary Tale On Trusting Industry Analysts

Many investors have feared the rise of the Chinese semiconductor industry, especially in equipment and chemicals. This alongside coverage from certain analysts has led to huge valuations in the Chinese equipment and chemical industry. This is a cautionary tale on trusting the word of analysts.

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