DRAM

AMD Apple Applied Materials DRAM GlobalFoundries Intel KLIC Logic Micron NAND Nvidia Packaging Samsung Tesla TSMC YMTC

Advanced Packaging Part 2 – Review Of Options/Use From Intel, TSMC, Samsung, AMD, ASE, Sony, Micron, SKHynix, YMTC, Tesla, and Nvidia

January 6, 2022April 9, 2022 Dylan Patel 2 Comments CoWoS-L, CoWoS-S, CoWoS-R, EMIB, FoCoS, FOEB, FOSiP, Foveros, Foveros Direct, Foveros Omni, HBM, I-Cube, InFO-LSI, InFO-OS, InFO-SoIS, InFO-SOW, SoIC, X-Cube, XStacking

Advanced packaging exists on a continuum of cost and throughput vs performance and density. Even though the demand for advanced packaging is obvious, there is an incredible number of advanced packaging types and brand names from Intel (EMIB, Foveros, Foveros Omni, Foveros Direct), TSMC (InFO-OS, InFO-LSI, InFO-SOW, InFO-SoIS, CoWoS-S, CoWoS-R, CoWoS-L, SoIC), Samsung (FOSiP, X-Cube, I-Cube, HBM, DDR/LPDDR DRAM, CIS), ASE (FoCoS, FOEB), Sony (CIS), Micron (HBM), SKHynix (HBM), and YMTC (XStacking). These packaging types are used by all of our favorite companies from AMD, Nvidia, and many more. In Part 2, we will explain all these types of packaging and their uses.

DRAM JSR Lam Research Logic Tokyo Electron

Lam Research, Tokyo Electron, JSR Battle It Out In The $5B+ EUV Photoresist, Coater, and Developer Market – CAR vs MOR vs Dry Resist

November 18, 2021November 18, 2021 Dylan Patel 0 Comments CaR, chemically amplified resist, dry deposit, dry develop, dry photo resist, Dry photoresist, dry resist, Lithius Pro Z, Metal oxide resist, MOR, photo resist, photoresist, spin coater, wet deposit, wet develop, wet photoresist

There is a battle brewing in the photoresist, coater, and developer market due to EUV advancement. This battle could cost Tokyo Electron their dominance over a $5B+ annual revenue market and lead to some photoresist companies such as TOK to lose a major market. JSR and Tokyo are bringing Metal Oxide Resist (MOR) to the market to fight off Lam Research’s encroachment with their dry resist technology.

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Advanced Packaging Part 2 – Review Of Options/Use From Intel, TSMC, Samsung, AMD, ASE, Sony, Micron, SKHynix, YMTC, Tesla, and Nvidia

Lam Research, Tokyo Electron, JSR Battle It Out In The $5B+ EUV Photoresist, Coater, and Developer Market – CAR vs MOR vs Dry Resist

Memory Oligopoly Woes – Micron Says They Will Not Increase Wafer Output In DRAM Or NAND For The Foreseeable Future

Fears for Chinese Semiconductor Capital Equipment and Chemical Supply Chain Are Overblown | Cautionary Tale On Trusting Industry Analysts

LAM Research (LRCX) Dry Deposit and Resist Could Become a Multi-Billion Dollar Business

Moore’s Law is Dead for DRAM and that is Great for SemiCap