CXL Enables Microsoft Azure To Cut Server Capital Expenditures By Hundreds Of Millions Of Dollars
CXL (Compute Express Link) is going to be a transformative technology that will redefine how the datacenter is architected and
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DRAM
Why America Will Lose Semiconductors – Tangible bi-partisan solutions for solving a national security crisis
Tangible bi-partisan solutions for solving a national security crisis.
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Packaging Developments From ECTC 2022 – TSMC CoWoS-R+, TSMC 4th Generation SoIC, Intel Collective Die To Wafer Hybrid Bonding, AMD V-Cache, Sony’s Leading 1-Micron Pitch Hybrid Bonding, MediaTek Networking SoC, Co-Packaged Optics, And More
TSMC CoWoS-R+, TSMC 4th Generation SoIC, Intel Collective Die To Wafer Hybrid Bonding, AMD V-Cache, Sony’s Leading 1-Micron Pitch Hybrid Bonding, MediaTek Networking SoC, and Co-Packaged Optics
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Marvell Acquires Tanzanite Silicon To Enable Composable Server Architectures Using CXL Based Memory Expansion And Pooling
Marvell has acquired Tanzanite Silicon Solutions. We talk through the reason for this acquisition, specs of SLIC, and competitive landscape in the CXL Memory Accelerator space.
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Semiconductor Roundup – AMD, NXP, Google, KLIC, Cirrus Logic, Entegris, SK Hynix, Lasertec, Rohm, Fabrinet – 2/1/2022
AMD, NXP, Google, KLIC, Cirrus Logic, Entegris, SK Hynix, Lasertec, Rohm, Fabrinet
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Advanced Packaging Part 2 – Review Of Options/Use From Intel, TSMC, Samsung, AMD, ASE, Sony, Micron, SKHynix, YMTC, Tesla, and Nvidia
Advanced packaging exists on a continuum of cost and throughput vs performance and density. Even though the demand for advanced packaging is obvious, there is an incredible number of advanced packaging types and brand names from Intel (EMIB, Foveros, Foveros Omni, Foveros Direct), TSMC (InFO-OS, InFO-LSI, InFO-SOW, InFO-SoIS, CoWoS-S, CoWoS-R, CoWoS-L, SoIC), Samsung (FOSiP, X-Cube, I-Cube, HBM, DDR/LPDDR DRAM, CIS), ASE (FoCoS, FOEB), Sony (CIS), Micron (HBM), SKHynix (HBM), and YMTC (XStacking). These packaging types are used by all of our favorite companies from AMD, Nvidia, and many more. In Part 2, we will explain all these types of packaging and their uses.
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Lam Research, Tokyo Electron, JSR Battle It Out In The $5B+ EUV Photoresist, Coater, and Developer Market – CAR vs MOR vs Dry Resist
There is a battle brewing in the photoresist, coater, and developer market due to EUV advancement. This battle could cost Tokyo Electron their dominance over a $5B+ annual revenue market and lead to some photoresist companies such as TOK to lose a major market. JSR and Tokyo are bringing Metal Oxide Resist (MOR) to the market to fight off Lam Research’s encroachment with their dry resist technology.
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Memory Oligopoly Woes – Micron Says They Will Not Increase Wafer Output In DRAM Or NAND For The Foreseeable Future
Short term risks related PC inventory/sales and weak China mobile sales weigh on the short term, but Micron is flexing the oligopoly muscle long term!
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Fears for Chinese Semiconductor Capital Equipment and Chemical Supply Chain Are Overblown | Cautionary Tale On Trusting Industry Analysts
Many investors have feared the rise of the Chinese semiconductor industry, especially in equipment and chemicals. This alongside coverage from certain analysts has led to huge valuations in the Chinese equipment and chemical industry. This is a cautionary tale on trusting the word of analysts.
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LAM Research (LRCX) Dry Deposit and Resist Could Become a Multi-Billion Dollar Business
The dry photoresist technology LAM has developed could become a multiple billion dollars business by the end of the decade.
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