Marvell has acquired Tanzanite Silicon Solutions. We talk through the reason for this acquisition, specs of SLIC, and competitive landscape in the CXL Memory Accelerator space.Read more
Tenstorrent have made some very large claims about the future of neural network model architectures, issues with edge versus datacenter, hardware performance / efficiency, and software prowess. In this article, we dive into these claims as well as their next generation hardware, Blackhole and Grendel.Read more
Deep dive on Graphcore’s Bow AI accelerator and wafer-on-wafer hybrid bonding technology including the purpose, advantages, cost, process flow, and whose semiconductor manufacturing tools are utilizedRead more
The hack contains sensitive info on future GPU configurations, source code for software, tester, simulation, and Verilog code.
This could be the most significant act of corporate espionage in a generation.
Western fabs and semiconductor capital equipment spending to go bonkersRead more
STMicroelectronics, KLA, MKS Instruments, Ampere Computing, Apple, Tesla, Silicon Motion Technology, MACOM TechnologyRead more
This will be our first of this type of post, but a flurry of semiconductor earnings releases and calls areRead more
Intel co-developed a thermocompression bonding tool which they own hundreds of. TCB is a key enabler in their advanced packaging strategy and a key differentiator versus their competition such as TSMC on a cost and integration basis.Read more
Advanced packaging exists on a continuum of cost and throughput vs performance and density. Even though the demand for advanced packaging is obvious, there is an incredible number of advanced packaging types and brand names from Intel (EMIB, Foveros, Foveros Omni, Foveros Direct), TSMC (InFO-OS, InFO-LSI, InFO-SOW, InFO-SoIS, CoWoS-S, CoWoS-R, CoWoS-L, SoIC), Samsung (FOSiP, X-Cube, I-Cube, HBM, DDR/LPDDR DRAM, CIS), ASE (FoCoS, FOEB), Sony (CIS), Micron (HBM), SKHynix (HBM), and YMTC (XStacking). These packaging types are used by all of our favorite companies from AMD, Nvidia, and many more. In Part 2, we will explain all these types of packaging and their uses.Read more
People all over semiconductor world have been speculating about the TSMC and Intel deal. SemiAnalysis wants to set the record straight on these. We are going to dive into the details for wafer supply agreements including prepayment terms and capacity agreements for AMD, Apple, Broadcom, Intel, MediaTek, Nvidia, and Qualcomm.Read more