Packaging Developments From ECTC 2022 – TSMC CoWoS-R+, TSMC 4th Generation SoIC, Intel Collective Die To Wafer Hybrid Bonding, AMD V-Cache, Sony’s Leading 1-Micron Pitch Hybrid Bonding, MediaTek Networking SoC, Co-Packaged Optics, And More

TSMC CoWoS-R+, TSMC 4th Generation SoIC, Intel Collective Die To Wafer Hybrid Bonding, AMD V-Cache, Sony’s Leading 1-Micron Pitch Hybrid Bonding, MediaTek Networking SoC, and Co-Packaged Optics

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Tenstorrent Blackhole, Grendel, And Buda – A Scale Out Architecture For Sparsity, Conditional Execution, And Dynamic Routing

Tenstorrent have made some very large claims about the future of neural network model architectures, issues with edge versus datacenter, hardware performance / efficiency, and software prowess. In this article, we dive into these claims as well as their next generation hardware, Blackhole and Grendel.

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