Tangible bi-partisan solutions for solving a national security crisis.Read more
Apple announced their new 20 billion transistor M2 SoC at WWDC. Unfortunately, it’s quite a minor uplift in performance inRead more
TSMC CoWoS-R+, TSMC 4th Generation SoIC, Intel Collective Die To Wafer Hybrid Bonding, AMD V-Cache, Sony’s Leading 1-Micron Pitch Hybrid Bonding, MediaTek Networking SoC, and Co-Packaged OpticsRead more
Die shot analysis shows 40% area reduction on identical structures from Intel 7 to Intel 4. Analysis on Redwood Cove and Crestmont architecture, Foveros Omni, Intel’s use of TSMC N3 in the GPU, and SOC/IO chipletsRead more
Marvell has acquired Tanzanite Silicon Solutions. We talk through the reason for this acquisition, specs of SLIC, and competitive landscape in the CXL Memory Accelerator space.Read more
Tenstorrent have made some very large claims about the future of neural network model architectures, issues with edge versus datacenter, hardware performance / efficiency, and software prowess. In this article, we dive into these claims as well as their next generation hardware, Blackhole and Grendel.Read more
Deep dive on Graphcore’s Bow AI accelerator and wafer-on-wafer hybrid bonding technology including the purpose, advantages, cost, process flow, and whose semiconductor manufacturing tools are utilizedRead more
The hack contains sensitive info on future GPU configurations, source code for software, tester, simulation, and Verilog code.
This could be the most significant act of corporate espionage in a generation.
Western fabs and semiconductor capital equipment spending to go bonkersRead more
STMicroelectronics, KLA, MKS Instruments, Ampere Computing, Apple, Tesla, Silicon Motion Technology, MACOM TechnologyRead more