Semiconductor Roundup – Intel, Teradyne, Lam Research, Wolfspeed, Texas Instruments, UMC, Xilinx, Samsung, MediaTek – 1/27/2022
This will be our first of this type of post, but a flurry of semiconductor earnings releases and calls are
Read moreThis will be our first of this type of post, but a flurry of semiconductor earnings releases and calls are
Read moreIn this multi-part series we will do a deep dive into the advanced packaging mega-trend. This will include a breakdown of the various types of advanced packaging, flows, tool types, and vendors. In part 1 we dive into what pad limited designs are, the slowdown of Moore’s Law and end of economic shrinks, heterogeneous compute, and the economic and design implications of chiplets.
Read moreQualcomm continues to accelerate their RFFE business by filling more gaps in their product line and building out more capabilities for 5G. With ultraSAW, ultraBAW, and other innovations in filters, modules, envelope trackers, and switches, Qualcomm will likely grow RFFE to $8B in 2025.
Read moreApple’s leading CPU team looks to be struggling as they have now delivered no CPU gains for the first generation ever. Apple likely had to delay their next core architecture due due to personnel overturn from the Nuvia exodus. Furthermore, with a new exodus surrounding Rivos, the future doesn’t look so bright. Apple currently has the best client CPU cores, but can they hold this lead against stronger competition from Intel, AMD, and Qualcomm?
Read moreNo, The iPhone 13 Does Not Have Satellite Internet | Band n53 & Globalstar Explained
Globalstar Sat’s useful life ends 2025-2028 and their future revenue is mostly from terrestrial spectrum licensing!
The stock shouldn’t be up 90%.
Arm China has gone completely rogue, operating as an independent company with their own IP and R&D. This is the semiconductor heist of the century. There are many questions swirling about what this means for a potential Nvidia takeover or IPO, but it is clear that SoftBank’s short sighted profit driven behavior has caused a massive conundrum.
Read moreMediaTek is targeting the flagship mobile world next year by shipping the highest density node, TSMC 4nm before anyone else. They will utilize the best standard Armv9 cores with X2, A710, and A510. It will also bring 5G GPP Release 16 support. MediaTek may snatch the Android CPU crown away from Qualcomm and Samsung!
Read moreApple has long been considered the primary TSMC partner as the first mover to new process technologies, but this is changing.
Based on comments from TSMC’s CEO, Qualcomm and/or MediaTek will be releasing a N3 smartphone SOC before Apple!
Qualcomm is changing the game in network infrastructure hardware with their 4nm FSM200 for small cells and the 5G Distributed Unit X100 Accelerator Card. Furthermore, their new features in 5G enable brand new use cases in automotive, factories, and supply chain!
Read moreSemiAnalysis total phone sales projections for the year have dropped by roughly 50 million units! Not everything is peachy keen in the year 2021, for the darling semiconductor industry.
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