Advanced Packaging Part 3 – Intel’s Curious Bet on Thermocompression Bonding, ASM Pacific, Kulicke and Soffa, and Besi TCB Tool Landscape

Intel co-developed a thermocompression bonding tool which they own hundreds of. TCB is a key enabler in their advanced packaging strategy and a key differentiator versus their competition such as TSMC on a cost and integration basis.

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Advanced Packaging Part 2 – Review Of Options/Use From Intel, TSMC, Samsung, AMD, ASE, Sony, Micron, SKHynix, YMTC, Tesla, and Nvidia

Advanced packaging exists on a continuum of cost and throughput vs performance and density. Even though the demand for advanced packaging is obvious, there is an incredible number of advanced packaging types and brand names from Intel (EMIB, Foveros, Foveros Omni, Foveros Direct), TSMC (InFO-OS, InFO-LSI, InFO-SOW, InFO-SoIS, CoWoS-S, CoWoS­-R, CoWoS-L, SoIC), Samsung (FOSiP, X-Cube, I-Cube, HBM, DDR/LPDDR DRAM, CIS), ASE (FoCoS, FOEB), Sony (CIS), Micron (HBM), SKHynix (HBM), and YMTC (XStacking). These packaging types are used by all of our favorite companies from AMD, Nvidia, and many more. In Part 2, we will explain all these types of packaging and their uses.

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Advanced Packaging Part 1 – Pad Limited Designs, Breakdown Of Economic Semiconductor Scaling, Heterogeneous Compute, and Chiplets

In this multi-part series we will do a deep dive into the advanced packaging mega-trend. This will include a breakdown of the various types of advanced packaging, flows, tool types, and vendors. In part 1 we dive into what pad limited designs are, the slowdown of Moore’s Law and end of economic shrinks, heterogeneous compute, and the economic and design implications of chiplets.

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Aehr Multi-Wafer Level Burn-in Test for Silicon Carbide and Silicon Photonics Applications

Test intensity for silicon carbide and photonics is very high due to extreme operating ranges. Wafer level burn in could transform the test life cycle for semiconductors. Major wins such as On Semiconductor and Intel validate this.

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Kulicke & Soffa Industries, $KLIC, Continued Outperformance Of Wire Bonders And Emerging Supplier in Mini-LED, Micro-LED, And Battery Manufacturing

Kulicke and Soffa Industries is continuing to outperform on the back of the wire bonder business. Additionally, they are emerging as a leading supplier in tools used for mini-LED, micro-LED, and battery manufacturing.

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Advanced Packaging The Size Of Your Monitor | Applied Materials, $AMAT, Modifies Panel PVD Tool For 60x60cm Fan Outs To Usher In A New Age Of Mega Packages

Applied Materials panel level packaging enabled advanced fan outs the as large as 600mm by 600mm. It can deposit layers as thin as 10um, and supports embedded die in substrate technologies like Intel’s EMIB or TSMC’s LSI

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Kulicke & Soffa Industries, $KLIC, Crushes Earnings But Continues To Sandbag, $6 EPS ’21, $6.75 EPS ’22

SemiAnalysis has been clamoring about $KLIC for nearly a year on Twitter and backchannels, and after outsized beats, we are even more bullish. Even after the recent run up, it is currently trading at about 10x SemiAnalysis’s 2021 Projected EPS ($6). This is above Wall Street consensus, but there is room for this estimate to be beaten. 2022 Projected EPS is $6.75.

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Tesla AI Day Supercomputer Chip Teaser | Is This The First Deployment Of TSMC InFO_SoW?

Tesla is known for having their own silicon strategy for their automobiles and was rumored to be working on a AI training chip for their own datacenter use cases as well. An image of this chip was posted and it is quite bizarre. It looks like it could be the first TSMC InFO_SoW product.

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Intel Grossly Exaggerates Foundry “Wins” With Qualcomm And Amazon, There Are No Deals For Manufacturing Chips

Intel touted huge wins with Qualcomm and Amazon for their foundry business, but a deeper investigation reveals there are no chips deals penned. Intel will only package for Amazon, and Qualcomm is only evaluating the technology.

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Rockley Photonics Will Revolutionize Healthcare By Measuring Biomarkers Such As Glucose With Lasers In The Apple Watch

Rockley Photonics ($SCPE) will revolutionize healthcare technology by enabling the Apple Watch to become a non-invasive laboratory grade spectrometer with “clinic on a wrist” capabilities such as continuous glucose monitor.
They utilize a proprietary silicon photonics process technology.

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