Intel co-developed a thermocompression bonding tool which they own hundreds of. TCB is a key enabler in their advanced packaging strategy and a key differentiator versus their competition such as TSMC on a cost and integration basis.Read more
Advanced packaging exists on a continuum of cost and throughput vs performance and density. Even though the demand for advanced packaging is obvious, there is an incredible number of advanced packaging types and brand names from Intel (EMIB, Foveros, Foveros Omni, Foveros Direct), TSMC (InFO-OS, InFO-LSI, InFO-SOW, InFO-SoIS, CoWoS-S, CoWoS-R, CoWoS-L, SoIC), Samsung (FOSiP, X-Cube, I-Cube, HBM, DDR/LPDDR DRAM, CIS), ASE (FoCoS, FOEB), Sony (CIS), Micron (HBM), SKHynix (HBM), and YMTC (XStacking). These packaging types are used by all of our favorite companies from AMD, Nvidia, and many more. In Part 2, we will explain all these types of packaging and their uses.Read more
In this multi-part series we will do a deep dive into the advanced packaging mega-trend. This will include a breakdown of the various types of advanced packaging, flows, tool types, and vendors. In part 1 we dive into what pad limited designs are, the slowdown of Moore’s Law and end of economic shrinks, heterogeneous compute, and the economic and design implications of chiplets.Read more
Test intensity for silicon carbide and photonics is very high due to extreme operating ranges. Wafer level burn in could transform the test life cycle for semiconductors. Major wins such as On Semiconductor and Intel validate this.Read more
Kulicke and Soffa Industries is continuing to outperform on the back of the wire bonder business. Additionally, they are emerging as a leading supplier in tools used for mini-LED, micro-LED, and battery manufacturing.Read more
Applied Materials panel level packaging enabled advanced fan outs the as large as 600mm by 600mm. It can deposit layers as thin as 10um, and supports embedded die in substrate technologies like Intel’s EMIB or TSMC’s LSIRead more
SemiAnalysis has been clamoring about $KLIC for nearly a year on Twitter and backchannels, and after outsized beats, we are even more bullish. Even after the recent run up, it is currently trading at about 10x SemiAnalysis’s 2021 Projected EPS ($6). This is above Wall Street consensus, but there is room for this estimate to be beaten. 2022 Projected EPS is $6.75.Read more
Tesla is known for having their own silicon strategy for their automobiles and was rumored to be working on a AI training chip for their own datacenter use cases as well. An image of this chip was posted and it is quite bizarre. It looks like it could be the first TSMC InFO_SoW product.Read more
Intel touted huge wins with Qualcomm and Amazon for their foundry business, but a deeper investigation reveals there are no chips deals penned. Intel will only package for Amazon, and Qualcomm is only evaluating the technology.Read more
Rockley Photonics ($SCPE) will revolutionize healthcare technology by enabling the Apple Watch to become a non-invasive laboratory grade spectrometer with “clinic on a wrist” capabilities such as continuous glucose monitor.
They utilize a proprietary silicon photonics process technology.