TSMC CoWoS-R+, TSMC 4th Generation SoIC, Intel Collective Die To Wafer Hybrid Bonding, AMD V-Cache, Sony’s Leading 1-Micron Pitch Hybrid Bonding, MediaTek Networking SoC, and Co-Packaged OpticsRead more
In this article, we will discuss Ayar Labs funding, the core problem they are solving, and do a deep dive on their technology offering.Read more
Test intensity for silicon carbide and photonics is very high due to extreme operating ranges. Wafer level burn in could transform the test life cycle for semiconductors. Major wins such as On Semiconductor and Intel validate this.Read more
Intel touted huge wins with Qualcomm and Amazon for their foundry business, but a deeper investigation reveals there are no chips deals penned. Intel will only package for Amazon, and Qualcomm is only evaluating the technology.Read more
Rockley Photonics ($SCPE) will revolutionize healthcare technology by enabling the Apple Watch to become a non-invasive laboratory grade spectrometer with “clinic on a wrist” capabilities such as continuous glucose monitor.
They utilize a proprietary silicon photonics process technology.
Rather than chasing Moore’s Law while ignoring all cost scaling, GlobalFoundries is pushing the bleeding edge of manufacturing in silicon photonics, usage of materials such as SiN and GaN for communications, 3D heterogenous integration, and FD-SOIRead more
Intel is struggling against TSMC, AMD, Apple, Nvidia, Amazon, etc.
They have a potential ace which would allow them to remain at the heart of datacenter and force industry dependency.
Co-packaged silicon photonics is Intel’s Trojan Horse into the foundry business!