DRAM

DRAM



Intel Icelake Server Die Size & Floorplan Inefficiencies Revealed


Dylan Patel
4

Icelake server CPUs are set to qualify for production at the end of Q4 2020 and ramp in Q1 2021



Apple A14 Die Annotation and Analysis – Terrifying Implications For The Industry


Dylan Patel
1

Despite TSMC’s claims of a 1.35x shrink on SRAM, Apple’s system cache has only shrunk 1.22x. This has far reaching implications for the industry.
Designers cannot use increased LLC sizes as a crutch forever given N5’s 1.35x SRAM shrink and N3’s paltry 1.2x.



Apple’s A14 Packs 134 Million Transistors/mm², but Falls Short of TSMC’s Density Claims


Dylan Patel
35

Our friends over at ICmasters have delved into the package of the Apple A14 Bionic. The die size has been



Qualcomm Lost the iPhone 12 mmWave Antenna Module Contract to a Chinese Company


Dylan Patel
4

iFixit’s teardown of the iPhone 12 has revealed that there are 3 mmWave antenna modules built by USI. USI is a Shanghai based SiP design and manufacturing company. This would be their first design win in the space. Apple ditching Qualcomm on this component despite using the rest of the Qualcomm X55 5G Modem RF system is quite the shocker. To emphasize the magnitude of this design win, every US phone shipment which included 5G mmWave to date has used antennas from Qualcomm.



Jensen Huang’s Vision For Data Center Dominance Will Destroy The Arm Ecosystem


Dylan Patel
7

Over time, Jensen Huang will muscle out other Arm vendors supplementing them with Nvidia’s in-house designs. The open Arm ecosystem will be hijacked, and be replaced with a closed off ecosystem rivaling or exceeding that of Intel and AMD.

%d bloggers like this: