Skip to content
Latest:
  • Achronix Goes Public | The Only Independent Leading Edge FPGA Silicon and IP Provider
  • Intel Icelake Server Die Size & Floorplan Inefficiencies Revealed
  • Apple A14 Die Annotation and Analysis – Terrifying Implications For The Industry
  • Apple’s A14 Packs 134 Million Transistors/mm², but Falls Short of TSMC’s Density Claims
  • Qualcomm Lost the iPhone 12 mmWave Antenna Module Contract to a Chinese Company

SemiAnalysis

Bridging the gap between business and the worlds most important industry.

  • Home
  • LOGIC
  • DRAM
  • NAND
  • Contact

3D SRAM

Apple Corporate Logic TSMC 

Apple’s A14 Packs 134 Million Transistors/mm², but Falls Short of TSMC’s Density Claims

October 27, 2020January 10, 2021 Dylan Patel 35 Comments 3D SRAM, ICmasters, N5, N7, SRAM, Stacked SRAM, TSMC, Wafer Pricing

Our friends over at ICmasters have delved into the package of the Apple A14 Bionic. The die size has been

Read more

Bridging the gap between business and the worlds most important industry.

Recent Posts

  • Achronix Goes Public | The Only Independent Leading Edge FPGA Silicon and IP Provider January 10, 2021
  • Intel Icelake Server Die Size & Floorplan Inefficiencies Revealed November 12, 2020
  • Apple A14 Die Annotation and Analysis – Terrifying Implications For The Industry October 30, 2020

Categories

  • Apple
  • Corporate
  • DRAM
  • Intel
  • Lam
  • Logic
  • Mobile
  • NAND
  • Nvidia
  • Qualcomm
  • TSMC

Tags

Apple Corporate DRAM Intel Lam Logic Mobile NAND Nvidia Qualcomm TSMC