Amazon Graviton 3 Uses Chiplets & Advanced Packaging To Commoditize High Performance CPUs | The First PCIe 5.0 And DDR5 Server CPU

Shots are being fired at merchant silicon.
Amazon’s Graviton3 completely commoditizes generalized CPU compute while also bringing advanced packaging, PCIe 5.0, and DDR5 to the server market ~6 months before Intel and AMD.
Server and rack level system architecture choices propel Graviton 3 to new heights in cost per unit of compute.
There’s something special about the packaging behind the paywall.

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The Impending Chinese NAND Apocalypse – YMTC 128 Layer NAND Is The First Semiconductor Where China Is Technologically Competitive

YMTC 128 Layer NAND is the first semiconductor where China is technologically competitive with the leading edge firms from the Western sphere of influence.
Yields are improving and the 2nd fab is being filled with equipment. Once that milestone is reached, the 3rd and 4th fab will be built simultaneously.

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Intel Grossly Exaggerates Foundry “Wins” With Qualcomm And Amazon, There Are No Deals For Manufacturing Chips

Intel touted huge wins with Qualcomm and Amazon for their foundry business, but a deeper investigation reveals there are no chips deals penned. Intel will only package for Amazon, and Qualcomm is only evaluating the technology.

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Micron Sells 3D X-Point Lehi, Utah Fab to Texas Instruments For $1.5B

Micron to Sell Lehi, Utah, Fab to Texas Instruments for $1.5B.
This is the fab that was part of the Intel/Micron IMFT joint venture. It currently produces 3D X-Point and NAND memory. Intel will need to ramp Optane production at another fab like their New Mexico fab.

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Intel’s Trojan Horse into the Foundry Business | Co-packaged Silicon Photonics is Intel’s Path Forward for IDM 2.0

Intel is struggling against TSMC, AMD, Apple, Nvidia, Amazon, etc.
They have a potential ace which would allow them to remain at the heart of datacenter and force industry dependency.
Co-packaged silicon photonics is Intel’s Trojan Horse into the foundry business!

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