People all over semiconductor world have been speculating about the TSMC and Intel deal. SemiAnalysis wants to set the record straight on these. We are going to dive into the details for wafer supply agreements including prepayment terms and capacity agreements for AMD, Apple, Broadcom, Intel, MediaTek, Nvidia, and Qualcomm.Read more
MediaTek is targeting the flagship mobile world next year by shipping the highest density node, TSMC 4nm before anyone else. They will utilize the best standard Armv9 cores with X2, A710, and A510. It will also bring 5G GPP Release 16 support. MediaTek may snatch the Android CPU crown away from Qualcomm and Samsung!Read more
Apple has long been considered the primary TSMC partner as the first mover to new process technologies, but this is changing.
Based on comments from TSMC’s CEO, Qualcomm and/or MediaTek will be releasing a N3 smartphone SOC before Apple!
Samsung Foundry 3nm Gate All Around Process Node, 3GAE, Delayed to 2024! This would arrive in a similar time frame to TSMC’s denser 2nm GAA technology.
Samsung and Intel continue to slip further behind TSMC in leading edge technology. Will they ever be able to catch up?