Advanced Packaging The Size Of Your Monitor | Applied Materials, $AMAT, Modifies Panel PVD Tool For 60x60cm Fan Outs To Usher In A New Age Of Mega Packages

Applied Materials panel level packaging enabled advanced fan outs the as large as 600mm by 600mm. It can deposit layers as thin as 10um, and supports embedded die in substrate technologies like Intel’s EMIB or TSMC’s LSI

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