Advanced Packaging Part 1 – Pad Limited Designs, Breakdown Of Economic Semiconductor Scaling, Heterogeneous Compute, and Chiplets

In this multi-part series we will do a deep dive into the advanced packaging mega-trend. This will include a breakdown of the various types of advanced packaging, flows, tool types, and vendors. In part 1 we dive into what pad limited designs are, the slowdown of Moore’s Law and end of economic shrinks, heterogeneous compute, and the economic and design implications of chiplets.

Read more