LATEST
Amazon Graviton 3 Uses Chiplets & Advanced Packaging To Commoditize High Performance CPUs | The First PCIe 5.0 And DDR5 Server CPU
Shots are being fired at merchant silicon.
Amazon’s Graviton3 completely commoditizes generalized CPU compute while also bringing advanced packaging, PCIe 5.0, and DDR5 to the server market ~6 months before Intel and AMD.
Server and rack level system architecture choices propel Graviton 3 to new heights in cost per unit of compute.
There’s something special about the packaging behind the paywall.
LOGIC
Amazon Graviton 3 Uses Chiplets & Advanced Packaging To Commoditize High Performance CPUs | The First PCIe 5.0 And DDR5 Server CPU
Shots are being fired at merchant silicon.
Amazon’s Graviton3 completely commoditizes generalized CPU compute while also bringing advanced packaging, PCIe 5.0, and DDR5 to the server market ~6 months before Intel and AMD.
Server and rack level system architecture choices propel Graviton 3 to new heights in cost per unit of compute.
There’s something special about the packaging behind the paywall.
Lam Research, Tokyo Electron, JSR Battle It Out In The $5B+ EUV Photoresist, Coater, and Developer Market – CAR vs MOR vs Dry Resist
There is a battle brewing in the photoresist, coater, and developer market due to EUV advancement. This battle could cost Tokyo Electron their dominance over a $5B+ annual revenue market and lead to some photoresist companies such as TOK to lose a major market. JSR and Tokyo are bringing Metal Oxide Resist (MOR) to the market to fight off Lam Research’s encroachment with their dry resist technology.
Intel Betting The Farm – Shrinking Business, Margins Down For Few Years, But Aggressively Investing $40B-$43B A Year And More With Subsidies
Intel could follow the path of many other American goliaths such as IBM and General Electric. A slow slide to irrelevancy, spinning off business, and bringing shame to what was once pride for American ingenuity. Instead of that conservative route, they are going to put the metal to the floor, spend every dime Intel makes on investing in more manufacturing, design, and in general catching up in technology.
DRAM
Lam Research, Tokyo Electron, JSR Battle It Out In The $5B+ EUV Photoresist, Coater, and Developer Market – CAR vs MOR vs Dry Resist
There is a battle brewing in the photoresist, coater, and developer market due to EUV advancement. This battle could cost Tokyo Electron their dominance over a $5B+ annual revenue market and lead to some photoresist companies such as TOK to lose a major market. JSR and Tokyo are bringing Metal Oxide Resist (MOR) to the market to fight off Lam Research’s encroachment with their dry resist technology.
NAND
Memory Oligopoly Woes – Micron Says They Will Not Increase Wafer Output In DRAM Or NAND For The Foreseeable Future
Short term risks related PC inventory/sales and weak China mobile sales weigh on the short term, but Micron is flexing the oligopoly muscle long term!
The Impending Chinese NAND Apocalypse – YMTC 128 Layer NAND Is The First Semiconductor Where China Is Technologically Competitive
YMTC 128 Layer NAND is the first semiconductor where China is technologically competitive with the leading edge firms from the Western sphere of influence.
Yields are improving and the 2nd fab is being filled with equipment. Once that milestone is reached, the 3rd and 4th fab will be built simultaneously.
Fears for Chinese Semiconductor Capital Equipment and Chemical Supply Chain Are Overblown | Cautionary Tale On Trusting Industry Analysts
Many investors have feared the rise of the Chinese semiconductor industry, especially in equipment and chemicals. This alongside coverage from certain analysts has led to huge valuations in the Chinese equipment and chemical industry. This is a cautionary tale on trusting the word of analysts.