Author: Gerald Wong
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Another Giant Leap: The Rubin CPX Specialized Accelerator & Rack
New Prefill Specialized GPU, Rack Architecture, BOM, Disaggregated PD, Higher Perf per TCO, Lower TCO, GDDR7 & HBM Market Trends
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AMD Advancing AI: MI350X and MI400 UALoE72, MI500 UAL256
Software Improvement, Marketing RDFs, AMD Fostering Neocloud, MI355 is not Rack Scale, MI400 is UALoE, Not UALink
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Energizing AI: Power Delivery Competition Heats Up Vicor, MPS, Delta, ADI, Renesas, Infineon
Nvidia H100, Google TPUv5, AMD MI300, Intel Gaudi3/PVC, Cerebras WSE2
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AI Expansion – Supply Chain Analysis For CoWoS And HBM
28 Upstream Suppliers Analyzed For Generative AI Torque
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NAND Flash Monopoly Broken? Tokyo Electron Moly Dep + Cryo Etch Takes On Lam Research For The Future Of NAND
>$1B Billion Dollar Revenue Impact Lam Research ‘25 Revenue from Cryo Etch + Moly Dep?
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GPT-4 Architecture, Infrastructure, Training Dataset, Costs, Vision, MoE
Demystifying GPT-4: The engineering tradeoffs that led OpenAI to their architecture.
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AI Capacity Constraints – CoWoS and HBM Supply Chain
Quarterly Ramp for Nvidia, Broadcom, Google, AMD, AMD Embedded (Xilinx), Amazon, Marvell, Microsoft, Alchip, Alibaba T-Head, ZTE Sanechips, Samsung, Micron, and SK Hynix
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AMD MI300 – Taming The Hype – AI Performance, Volume Ramp, Customers, Cost, IO, Networking, Software
Amazing engineering, but what of the path to market?
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Zen 4c: AMD’s Response to Hyperscale ARM & Intel Atom
Bergamo Volumes, ASP, Performance, Hyperscale Order Shift, Die Shot, Floorplan, Physical Design, and Future Use of Dense Core Variants
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