Dan Nishball
Director of Research, SemiAnalysis
Dan is the Director of Research at SemiAnalysis, where he leads analytical efforts across AI infrastructure and compute. With deep technical expertise and strategic insight, he leads research from transistor-level innovation to hyperscale AI deployment. Dan’s focus areas of research include Networking and Optical, AI Systems and Neocloud Systems and Economics. His work spans the full stack – producing influential research that supports decision makers at the world’s leading technology firms, investment funds, and beyond.
Dan Nishball
Director of Research, SemiAnalysis
Dan is the Director of Research at SemiAnalysis, where he leads analytical efforts across AI infrastructure and compute. With deep technical expertise and strategic insight, he leads research from transistor-level innovation to hyperscale AI deployment. Dan’s focus areas of research include Networking and Optical, AI Systems and Neocloud Systems and Economics. His work spans the full stack – producing influential research that supports decision makers at the world’s leading technology firms, investment funds, and beyond.
Articles by Dan Nishball:
-
GB200 Hardware Architecture – Component Supply Chain & BOM
Hyperscale customization, NVLink Backplane, NVL36, NVL72, NVL576, PCIe Retimers, Switches, Optics, DSP, PCB, InfiniBand/Ethernet, Substrate, CCL, CDU, Sidecar, PDU, VRM, Busbar, Railkit, BMC
-
100,000 H100 Clusters: Power, Network Topology, Ethernet vs InfiniBand, Reliability, Failures, Checkpointing
Frontier Model Scaling Challenges and Requirements, Fault Recovery through Memory Reconstruction, Rack Layouts
-
How Dell Is Beating Supermicro
Enterprises, Sovereign AI, CoreWeave, Tesla, x.AI, AI Neocloud economics + orders
-
OpenAI Is Doomed? – Et tu, Microsoft?
Meta, Google, Anthropic, DeepSeek, Inflection Phi Wizard, Distribution/Integration vs Capital/Compute?
-
Nvidia Blackwell Perf TCO Analysis – B100 vs B200 vs GB200 NVL72
GPT-4 Profitability, Cost, Inference Simulator, Parallelism Explained, Performance TCO Modeling In Large & Small Model Inference and Training
-
Is Intel Back? Foundry & Product Resurgence Measured
Foundry Cost Wall, Whale Customers, Datacenter Share, The Money Problem
-
Nvidia’s Optical Boogeyman – NVL72, Infiniband Scale Out, 800G & 1.6T Ramp
Transceiver to GPU Ratio, DSP Growth, Revealing The Real Boogeyman
-
AI Datacenter Energy Dilemma – Race for AI Datacenter Space
Gigawatt Dreams and Matroyshka Brains Limited By Datacenters Not Chips
-
Groq Inference Tokenomics: Speed, But At What Cost?
Faster than Nvidia? Dissecting the economics
-
Intel GenAI For Yield, TSMC CFET & 3D Stacking, AMD 3D Device Modeling, Applied Materials Material Innovation, SK Hynix HBM4, Micron 3D DRAM & FeRAM, Hybrid Bonding vs TCB – IEDM 2023
China’s CXMT Sanctions Violation, Samsung 1000-layer Vertical NAND (VNAND), Kioxia highest density CMOS bonded to array (CBA) NAND, Micron non-volatile FeRAM with competitive density and performance
