Dylan Patel
Founder, CEO, and Chief Analyst, SemiAnalysis
Dylan is the Founder, CEO, and Chief Analyst of SemiAnalysis – the preeminent authority on all things AI and semiconductors. Through Dylan’s unwavering commitment to excellence, he has built the firm from the ground up as the recognized authority on the semiconductor supply chain to the cloud ecosystem, machine learning models, and all things in between. Since 2020, SemiAnalysis has transformed its business from a solo venture into a cohesive and focused team to provide breaking news and in-depth analysis for the most strategic, complex, and escalating challenges in the semiconductor industry.
Dylan Patel
Founder, CEO, and Chief Analyst, SemiAnalysis
Dylan is the Founder, CEO, and Chief Analyst of SemiAnalysis – the preeminent authority on all things AI and semiconductors. Through Dylan’s unwavering commitment to excellence, he has built the firm from the ground up as the recognized authority on the semiconductor supply chain to the cloud ecosystem, machine learning models, and all things in between. Since 2020, SemiAnalysis has transformed its business from a solo venture into a cohesive and focused team to provide breaking news and in-depth analysis for the most strategic, complex, and escalating challenges in the semiconductor industry.
Articles by Dylan Patel:
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SiFive Powers Google TPU, NASA, Tenstorrent, Renesas, Microchip, And More
RISC-V Is The Standard For non-user-facing functions.
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Meta Discusses AI Hardware and Co-packaged Optics
Nvidia Is Playing A Different Ball Game
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Is mmWave Adoption Stagnating? Qualcomm’s $6B Opportunity Update, $QCOM EPS Estimates
iPhone 14, Jio, Samsung, and Meta Updates
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How Onto Innovation Is Gaining Market Share From KLA – $ONTO $KLA
Gate All Around, 3D NAND, and 3D DRAM Metrology And Inspection
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Astera Labs Is First To CXL Memory Pooling Silicon – Beating Marvell, Rambus, Microchip, and Montage Technologies
Astera Labs Leo has a feature and time-to-market advantage.
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Austria’s Silent Monopolies On Advanced Semiconductor Manufacturing – EV Group and IMS Nanofabrication
All advanced logic, DRAM, NAND, and CMOS image sensor fabrication is dependent on Austria
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Beyond Advanced Packaging: Lightmatter Passage Chiplets Co-Packaged On Optical Interposer
But will products utilize this in volume?
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CXL Deep Dive – Future of Composable Server Architecture and Heterogeneous Compute, Products From 20 Firms, Overview of 3.0 Standard
Future CXL Products From 20 Firms Reviewed
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GlobalFoundries Stuffing Customers With High Inventory – Underweight $GFS
We are bearish on GlobalFoundries.
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