Dylan Patel
Founder, CEO, and Chief Analyst, SemiAnalysis
Dylan is the Founder, CEO, and Chief Analyst of SemiAnalysis – the preeminent authority on all things AI and semiconductors. Through Dylan’s unwavering commitment to excellence, he has built the firm from the ground up as the recognized authority on the semiconductor supply chain to the cloud ecosystem, machine learning models, and all things in between. Since 2020, SemiAnalysis has transformed its business from a solo venture into a cohesive and focused team to provide breaking news and in-depth analysis for the most strategic, complex, and escalating challenges in the semiconductor industry.
Dylan Patel
Founder, CEO, and Chief Analyst, SemiAnalysis
Dylan is the Founder, CEO, and Chief Analyst of SemiAnalysis – the preeminent authority on all things AI and semiconductors. Through Dylan’s unwavering commitment to excellence, he has built the firm from the ground up as the recognized authority on the semiconductor supply chain to the cloud ecosystem, machine learning models, and all things in between. Since 2020, SemiAnalysis has transformed its business from a solo venture into a cohesive and focused team to provide breaking news and in-depth analysis for the most strategic, complex, and escalating challenges in the semiconductor industry.
Articles by Dylan Patel:
-
Nvidia In The Hot Seat?
Intel Habana, Graphcore, Google TPU, and Nvidia A100 Compared In AI Training
By -
Qualcomm RFFE Update – $8B By 2025, 2023 iPhone Modem, WiFi 7 and Filter Socket Competition With Broadcom, $3B Automotive RF TAM
2023 iPhone Modem, WiFi 7 and Filter Socket Competition With Broadcom
By -
Can You Trust Semiconductor Capital Equipment Firms? Supply Chain Or Technology…
Includes Tracking Sheet With 106 Active Projects In Supply Chain
By -
Die Size And Reticle Conundrum – Cost Model With Lithography Scanner Throughput
Smaller Chiplets Isn't Always Better
By -
Why America Will Lose Semiconductors
Tangible bi-partisan solutions for solving a national security crisis.
By -
Packaging Developments From ECTC 2022
TSMC CoWoS-R+, TSMC 4th Generation SoIC, Intel Collective Die To Wafer Hybrid Bonding, AMD V-Cache, Sony's Leading 1-Micron Pitch Hybrid Bonding, MediaTek Networking SoC, and Co-Packaged Optics
By
