Dylan Patel
Founder, CEO, and Chief Analyst, SemiAnalysis
Dylan is the Founder, CEO, and Chief Analyst of SemiAnalysis – the preeminent authority on all things AI and semiconductors. Through Dylan’s unwavering commitment to excellence, he has built the firm from the ground up as the recognized authority on the semiconductor supply chain to the cloud ecosystem, machine learning models, and all things in between. Since 2020, SemiAnalysis has transformed its business from a solo venture into a cohesive and focused team to provide breaking news and in-depth analysis for the most strategic, complex, and escalating challenges in the semiconductor industry.
Dylan Patel
Founder, CEO, and Chief Analyst, SemiAnalysis
Dylan is the Founder, CEO, and Chief Analyst of SemiAnalysis – the preeminent authority on all things AI and semiconductors. Through Dylan’s unwavering commitment to excellence, he has built the firm from the ground up as the recognized authority on the semiconductor supply chain to the cloud ecosystem, machine learning models, and all things in between. Since 2020, SemiAnalysis has transformed its business from a solo venture into a cohesive and focused team to provide breaking news and in-depth analysis for the most strategic, complex, and escalating challenges in the semiconductor industry.
Articles by Dylan Patel:
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Hybrid Bonding Process Flow – Advanced Packaging Part 5
BESI, EV Group, AMAT, TEL, ASMPT, SET, Shibaura, SUSS Microtec
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Neural Network Quantization & Number Formats From First Principles
Inference & Training – Next Gen Hardware for Nvidia, AMD, Intel, Google, Microsoft, Meta, Arm, Qualcomm, MatX and Lemurian Labs
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Intel GenAI For Yield, TSMC CFET & 3D Stacking, AMD 3D Device Modeling, Applied Materials Material Innovation, SK Hynix HBM4, Micron 3D DRAM & FeRAM, Hybrid Bonding vs TCB – IEDM 2023
China’s CXMT Sanctions Violation, Samsung 1000-layer Vertical NAND (VNAND), Kioxia highest density CMOS bonded to array (CBA) NAND, Micron non-volatile FeRAM with competitive density and performance
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Inference Race To The Bottom – Make It Up On Volume?
Mixtral Inference Costs on H100, MI300X, H200, A100, Speculative Decoding
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ASML Dilemma: High-NA EUV is Worse vs Low-NA EUV Multi-Patterning
Cost model for low- & high-NA EUV, Feature Fidelity, Technical Challenges
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AMD MI300 Performance – Faster Than H100, But How Much?
MI400 Broadcom + AMD Anti-Nvidia Alliance Coming With UEC and Open XGMI
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GPU Cloud Economics Explained – The Neocloud Hidden Truth
CPU vs GPU Cloud Differences, TCO Model, PUE, Hyperscalers Disadvantage
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Microsoft Swallows OpenAI’s Core Team – GPU Capacity, Incentive Structure, Intellectual Property, OpenAI Rump State
OpenAI is nothing without its people.
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Microsoft Infrastructure – AI & CPU Custom Silicon Maia 100, Athena, Cobalt 100
Specifications, Volumes, GPT-4 performance, Next Generation Timing / Name, Backend Design Partner
