Jeff Koch
Analyst
Jeff Koch is an analyst at SemiAnalysis where he covers wafer fab equipment, materials, and process technologies. He has previously spent seven years in technical and business roles with ASML and Cymer, supporting next-generation lithography and excimer laser systems.
Jeff holds a Bachelor of Science in Mechanical Engineering from Cornell University, and lives in Park City, Utah, with his wife and their dog.
Jeff Koch
Analyst
Jeff Koch is an analyst at SemiAnalysis where he covers wafer fab equipment, materials, and process technologies. He has previously spent seven years in technical and business roles with ASML and Cymer, supporting next-generation lithography and excimer laser systems.
Jeff holds a Bachelor of Science in Mechanical Engineering from Cornell University, and lives in Park City, Utah, with his wife and their dog.
Articles by Jeff Koch:
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Intel’s 14A Magic Bullet: Directed Self-Assembly (DSA)
How High-NA EUV can be economically viable at the 1.4nm process node
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Is Intel Back? Foundry & Product Resurgence Measured
Foundry Cost Wall, Whale Customers, Datacenter Share, The Money Problem
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Hybrid Bonding Process Flow – Advanced Packaging Part 5
BESI, EV Group, AMAT, TEL, ASMPT, SET, Shibaura, SUSS Microtec
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Intel GenAI For Yield, TSMC CFET & 3D Stacking, AMD 3D Device Modeling, Applied Materials Material Innovation, SK Hynix HBM4, Micron 3D DRAM & FeRAM, Hybrid Bonding vs TCB – IEDM 2023
China’s CXMT Sanctions Violation, Samsung 1000-layer Vertical NAND (VNAND), Kioxia highest density CMOS bonded to array (CBA) NAND, Micron non-volatile FeRAM with competitive density and performance
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ASML Dilemma: High-NA EUV is Worse vs Low-NA EUV Multi-Patterning
Cost model for low- & high-NA EUV, Feature Fidelity, Technical Challenges
