SemiAnalysis VR NVL72 Component BoM and Power Budget Model
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- System-level bill of materials and integrated power view for the NVL72 platform
- Compute and interconnect modules (Strata module with Rubin GPU, Vera CPU, SOCAMM memory; BlueField-4; ConnectX-9)
- NVLink and switching infrastructure (NVSwitch, NVLink backplane and cabling, associated connectors and VRMs)
- System and tray infrastructure (compute tray and midplane, host CPU management module)
- Thermal and liquid-cooling architecture (cold plates, manifolds, rack manifold, quick disconnects, fans)
- PCB, substrate, and materials content (key system boards, ABF substrates, laminate and glass fiber content)
- Power delivery and supply (power shelves, busbars, connectors, VRMs, power delivery modules)

