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  • Groq Inference Tokenomics: Speed, But At What Cost?
    February 21, 2024

    Groq Inference Tokenomics: Speed, But At What Cost?

    Faster than Nvidia? Dissecting the economics

    By

    Dylan Patel

    and

    Daniel Nishball

  • Hybrid Bonding Process Flow – Advanced Packaging Part 5
    February 9, 2024

    Hybrid Bonding Process Flow – Advanced Packaging Part 5

    BESI, EV Group, AMAT, TEL, ASMPT, SET, Shibaura, SUSS Microtec

    By

    Dylan Patel

    ,

    Myron Xie

    and

    Jeff Koch

  • Compliance Policies
    February 3, 2024

    Compliance Policies

    By

    Dylan Patel

  • Neural Network Quantization & Number Formats From First Principles
    January 11, 2024

    Neural Network Quantization & Number Formats From First Principles

    Inference & Training – Next Gen Hardware for Nvidia, AMD, Intel, Google, Microsoft, Meta, Arm, Qualcomm, MatX and Lemurian Labs

    By

    Dylan Patel

  • Intel GenAI For Yield, TSMC CFET & 3D Stacking, AMD 3D Device Modeling, Applied Materials Material Innovation, SK Hynix HBM4, Micron 3D DRAM & FeRAM, Hybrid Bonding vs TCB – IEDM 2023
    January 3, 2024

    Intel GenAI For Yield, TSMC CFET & 3D Stacking, AMD 3D Device Modeling, Applied Materials Material Innovation, SK Hynix HBM4, Micron 3D DRAM & FeRAM, Hybrid Bonding vs TCB – IEDM 2023

    China’s CXMT Sanctions Violation, Samsung 1000-layer Vertical NAND (VNAND), Kioxia highest density CMOS bonded to array (CBA) NAND, Micron non-volatile FeRAM with competitive density and performance

    By

    Dylan Patel

    ,

    Jeff Koch

    ,

    Myron Xie

    ,

    Daniel Nishball

    and

    Anand Chamarthy

  • Inference Race To The Bottom – Make It Up On Volume?
    December 18, 2023

    Inference Race To The Bottom – Make It Up On Volume?

    Mixtral Inference Costs on H100, MI300X, H200, A100, Speculative Decoding

    By

    Dylan Patel

    and

    Daniel Nishball

  • ASML Dilemma: High-NA EUV is Worse vs Low-NA EUV Multi-Patterning
    December 11, 2023

    ASML Dilemma: High-NA EUV is Worse vs Low-NA EUV Multi-Patterning

    Cost model for low- & high-NA EUV, Feature Fidelity, Technical Challenges

    By

    Dylan Patel

    ,

    Jeff Koch

    and

    Lithos Graphein

  • AMD MI300 Performance – Faster Than H100, But How Much?
    December 6, 2023

    AMD MI300 Performance – Faster Than H100, But How Much?

    MI400 Broadcom + AMD Anti-Nvidia Alliance Coming With UEC and Open XGMI

    By

    Dylan Patel

    and

    Daniel Nishball

  • GPU Cloud Economics Explained – The Neocloud Hidden Truth
    December 4, 2023

    GPU Cloud Economics Explained – The Neocloud Hidden Truth

    CPU vs GPU Cloud Differences, TCO Model, PUE, Hyperscalers Disadvantage

    By

    Dylan Patel

    and

    Daniel Nishball

  • Microsoft Swallows OpenAI’s Core Team – GPU Capacity, Incentive Structure, Intellectual Property, OpenAI Rump State
    November 20, 2023

    Microsoft Swallows OpenAI’s Core Team – GPU Capacity, Incentive Structure, Intellectual Property, OpenAI Rump State

    OpenAI is nothing without its people.

    By

    Dylan Patel

    and

    Daniel Nishball

←Previous
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