The AI buildout, quantified.

AI Networking Model

Cluster networking

Quantitative model of AI cluster networking spend: switches, transceivers, AECs, and DACs across scale-up, scale-out, and front-end networks, with vendor market share and next-generation optical interconnects.

Spend forecast Cluster architecture Institutional

Memory Model

DRAM & NAND

DRAM and NAND cycle tracker: wafer capacity, bit supply, HBM pricing, inventory levels, and node transition timelines, covering Samsung, SK hynix, and Micron with fab-level output.

Cycle tracker Pricing risk Institutional

Space DC TCO Model

Orbital compute

Scenario-based total cost model for orbital compute: launch economics, thermal rejection, GPU-level TCO, and cost crossover against terrestrial datacenters through 2050.

Scenario model Emerging deployments Institutional

Tokenomics Model

Serving economics

Unit economics engine for AI serving: bottoms-up token throughput, ROI on AI spend, and demand-side translation of revenue into future accelerator demand by hyperscaler, lab, and neocloud.

Unit economics Inference strategy Institutional

Energy Model

Grid demand

Translates AI datacenter buildout into power infrastructure demand: utility-level supply and demand gaps, generator inventory, renewable PPAs, gas turbine lead times, and where the grid will fall short.

Power forecast Energy planning Institutional

Industrials Model

Supply-chain map

Datacenter supply-chain map: 500+ suppliers, top-down TAM, capex per megawatt, and bottom-up revenue build across power, cooling, and facilities, from switchgear and transformers to liquid cooling loops.

Supply-chain map End-market exposure Institutional

Foundry Industry Model

Wafer economics

Competitive capacity model covering TSMC, Samsung, Intel Foundry, SMIC, and emerging players: wafer shipments, ASPs, utilization, and node mix through 2030.

Capacity model Foundry strategy Institutional

ChipBook

Industry tracker

Monthly AI and semiconductor industry tracker: 125+ datasets covering the full value chain. Core industry trackers, memory trackers, and hand-picked timely datasets distilled from our proprietary models.

PDF + Excel dataset Idea generation

VR NVL72 Component BoM & Power Model

Platform BoM

System-level bill of materials and integrated power view for the NVL72 platform: compute modules, NVLink switching, tray infrastructure, thermal and cooling, PCB and substrate, and power delivery.

BoM + power budget NVL72 supply chain