Dylan Patel
Founder, CEO, and Chief Analyst, SemiAnalysis
Dylan is the Founder, CEO, and Chief Analyst of SemiAnalysis – the preeminent authority on all things AI and semiconductors. Through Dylan’s unwavering commitment to excellence, he has built the firm from the ground up as the recognized authority on the semiconductor supply chain to the cloud ecosystem, machine learning models, and all things in between. Since 2020, SemiAnalysis has transformed its business from a solo venture into a cohesive and focused team to provide breaking news and in-depth analysis for the most strategic, complex, and escalating challenges in the semiconductor industry.
Dylan Patel
Founder, CEO, and Chief Analyst, SemiAnalysis
Dylan is the Founder, CEO, and Chief Analyst of SemiAnalysis – the preeminent authority on all things AI and semiconductors. Through Dylan’s unwavering commitment to excellence, he has built the firm from the ground up as the recognized authority on the semiconductor supply chain to the cloud ecosystem, machine learning models, and all things in between. Since 2020, SemiAnalysis has transformed its business from a solo venture into a cohesive and focused team to provide breaking news and in-depth analysis for the most strategic, complex, and escalating challenges in the semiconductor industry.
Articles by Dylan Patel:
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Clash of the Foundries: Gate All Around + Backside Power at 2nm
Fab Cost, SRAM Scaling, WFE Implications, Backside Power Details, TSMC, Samsung, Intel, Rapidus
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Multi-Datacenter Training: OpenAI’s Ambitious Plan To Beat Google’s Infrastructure
Gigawatt Clusters, Telecom Networking, Long Haul Fiber, Hierarchical & Asynchronous SGD, Distributed Infrastructure Winners
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The Memory Wall: Past, Present, and Future of DRAM
Winners & Losers in the 3D DRAM Revolution
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Nvidia’s Blackwell Reworked – Shipment Delays & GB200A Reworked Platforms
MGX GB200A NVL36, B102, B20, CoWoS-L, CoWoS-S, GB200A NVL64, ConnectX-8, Liquid Cooling vs Air Cooling, NVLink Backplane, PCB, CCL, Substrate, BMC, Power Delivery
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GB200 Hardware Architecture – Component Supply Chain & BOM
Hyperscale customization, NVLink Backplane, NVL36, NVL72, NVL576, PCIe Retimers, Switches, Optics, DSP, PCB, InfiniBand/Ethernet, Substrate, CCL, CDU, Sidecar, PDU, VRM, Busbar, Railkit, BMC
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100,000 H100 Clusters: Power, Network Topology, Ethernet vs InfiniBand, Reliability, Failures, Checkpointing
Frontier Model Scaling Challenges and Requirements, Fault Recovery through Memory Reconstruction, Rack Layouts
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OpenAI Chip Team Is Now Serious
Poaching Aggressively
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How Dell Is Beating Supermicro
Enterprises, Sovereign AI, CoreWeave, Tesla, x.AI, AI Neocloud economics + orders
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Apple’s AI Strategy: Apple Datacenters, On-device, Cloud, And More
When to run on-device, in Apple datacenters, or in the cloud with OpenAI, Deal economics
